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- Publisher Website: 10.1109/TCAD.2018.2846650
- Scopus: eid_2-s2.0-85048556701
- WOS: WOS:000472568000001
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Article: Affinity-Driven Modeling and Scheduling for Makespan Optimization in Heterogeneous Multiprocessor Systems
Title | Affinity-Driven Modeling and Scheduling for Makespan Optimization in Heterogeneous Multiprocessor Systems |
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Authors | |
Keywords | Affinity-driven modeling makespan reliability scheduling stochastic dependent tasks temperature |
Issue Date | 2019 |
Citation | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2019, v. 38, n. 7, p. 1189-1202 How to Cite? |
Abstract | With the advent of heterogeneous multiprocessor architectures, efficient scheduling for high performance has been of significant importance. However, joint considerations of reliability, temperature, and stochastic characteristics of precedence-constrained tasks for performance optimization make task scheduling particularly challenging. In this paper, we tackle this challenge by using an affinity (i.e., probability)-driven task allocation and scheduling approach that decouples schedule lengths and thermal profiles of processors. Specifically, we separately model the affinity of a task for processors with respect to schedule lengths and the affinity of a task for processors with regard to chip thermal profiles considering task reliability and stochastic characteristics of task execution time and intertask communication time. Subsequently, we combine the two types of affinities, and design a scheduling heuristic that assigns a task to the processor with the highest joint affinity. Extensive simulations based on randomly generated stochastic and real-world applications are performed to validate the effectiveness of the proposed approach. Experiment results show that the proposed scheme can reduce the system makespan by up to 30.1% without violating the temperature and reliability constraints compared to benchmarking methods. |
Persistent Identifier | http://hdl.handle.net/10722/336195 |
ISSN | 2023 Impact Factor: 2.7 2023 SCImago Journal Rankings: 0.957 |
ISI Accession Number ID |
DC Field | Value | Language |
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dc.contributor.author | Cao, Kun | - |
dc.contributor.author | Zhou, Junlong | - |
dc.contributor.author | Cong, Peijin | - |
dc.contributor.author | Li, Liying | - |
dc.contributor.author | Wei, Tongquan | - |
dc.contributor.author | Chen, Mingsong | - |
dc.contributor.author | Hu, Shiyan | - |
dc.contributor.author | Hu, Xiaobo Sharon | - |
dc.date.accessioned | 2024-01-15T08:24:21Z | - |
dc.date.available | 2024-01-15T08:24:21Z | - |
dc.date.issued | 2019 | - |
dc.identifier.citation | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2019, v. 38, n. 7, p. 1189-1202 | - |
dc.identifier.issn | 0278-0070 | - |
dc.identifier.uri | http://hdl.handle.net/10722/336195 | - |
dc.description.abstract | With the advent of heterogeneous multiprocessor architectures, efficient scheduling for high performance has been of significant importance. However, joint considerations of reliability, temperature, and stochastic characteristics of precedence-constrained tasks for performance optimization make task scheduling particularly challenging. In this paper, we tackle this challenge by using an affinity (i.e., probability)-driven task allocation and scheduling approach that decouples schedule lengths and thermal profiles of processors. Specifically, we separately model the affinity of a task for processors with respect to schedule lengths and the affinity of a task for processors with regard to chip thermal profiles considering task reliability and stochastic characteristics of task execution time and intertask communication time. Subsequently, we combine the two types of affinities, and design a scheduling heuristic that assigns a task to the processor with the highest joint affinity. Extensive simulations based on randomly generated stochastic and real-world applications are performed to validate the effectiveness of the proposed approach. Experiment results show that the proposed scheme can reduce the system makespan by up to 30.1% without violating the temperature and reliability constraints compared to benchmarking methods. | - |
dc.language | eng | - |
dc.relation.ispartof | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | - |
dc.subject | Affinity-driven modeling | - |
dc.subject | makespan | - |
dc.subject | reliability | - |
dc.subject | scheduling | - |
dc.subject | stochastic dependent tasks | - |
dc.subject | temperature | - |
dc.title | Affinity-Driven Modeling and Scheduling for Makespan Optimization in Heterogeneous Multiprocessor Systems | - |
dc.type | Article | - |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1109/TCAD.2018.2846650 | - |
dc.identifier.scopus | eid_2-s2.0-85048556701 | - |
dc.identifier.volume | 38 | - |
dc.identifier.issue | 7 | - |
dc.identifier.spage | 1189 | - |
dc.identifier.epage | 1202 | - |
dc.identifier.isi | WOS:000472568000001 | - |