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- Publisher Website: 10.1016/j.surfin.2024.104249
- Scopus: eid_2-s2.0-85189179135
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Article: Plasma bias homopolar sputtering technology and its application to enhance bioactivity of polyetheretherketone surface
Title | Plasma bias homopolar sputtering technology and its application to enhance bioactivity of polyetheretherketone surface |
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Authors | |
Keywords | Osteointegration Plasma sputtering Polyetheretherketone Surface modification |
Issue Date | 26-Mar-2024 |
Publisher | Elsevier |
Citation | Surfaces and Interfaces, 2024, v. 48 How to Cite? |
Abstract | Numerous strategies have been developed to deposit metal-based films on biomedical implants to improve their performances. As a promising strategy, vacuum plasma plating technology can introduce many bioactive metals on the implant surface and achieve strong interfacial bonding. However, there are still limitations in the surface modification of a non-conductive matrix. Here, a simple and universal plasma-based technique termed plasma bias homopolar sputtering (PBHS) was presented to modify the insulating and conductive materials. The technical principles and characteristics of PBHS were comprehensively studied. As a demonstration, the Fe-based film was prepared on the surface of an insulating polyetheretherketone (PEEK) by PBHS to improve its biological performance. The as-prepared Fe-based film exhibited low elasticity modulus and good hydrophilicity, enhancing the adhesion, proliferation, and osteogenic differentiation of rat bone marrow mesenchymal stem cells. This work provides a simple and universal technique for the preparation of metal-based films, holding great potential for the surface modification of biomedical implants. |
Persistent Identifier | http://hdl.handle.net/10722/345789 |
ISSN | 2023 Impact Factor: 5.7 2023 SCImago Journal Rankings: 0.940 |
DC Field | Value | Language |
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dc.contributor.author | Hou, Zhiyu | - |
dc.contributor.author | Tan, Ji | - |
dc.contributor.author | Yeung, Kelvin WK | - |
dc.contributor.author | Liu, Xuanyong | - |
dc.date.accessioned | 2024-08-28T07:40:44Z | - |
dc.date.available | 2024-08-28T07:40:44Z | - |
dc.date.issued | 2024-03-26 | - |
dc.identifier.citation | Surfaces and Interfaces, 2024, v. 48 | - |
dc.identifier.issn | 2468-0230 | - |
dc.identifier.uri | http://hdl.handle.net/10722/345789 | - |
dc.description.abstract | Numerous strategies have been developed to deposit metal-based films on biomedical implants to improve their performances. As a promising strategy, vacuum plasma plating technology can introduce many bioactive metals on the implant surface and achieve strong interfacial bonding. However, there are still limitations in the surface modification of a non-conductive matrix. Here, a simple and universal plasma-based technique termed plasma bias homopolar sputtering (PBHS) was presented to modify the insulating and conductive materials. The technical principles and characteristics of PBHS were comprehensively studied. As a demonstration, the Fe-based film was prepared on the surface of an insulating polyetheretherketone (PEEK) by PBHS to improve its biological performance. The as-prepared Fe-based film exhibited low elasticity modulus and good hydrophilicity, enhancing the adhesion, proliferation, and osteogenic differentiation of rat bone marrow mesenchymal stem cells. This work provides a simple and universal technique for the preparation of metal-based films, holding great potential for the surface modification of biomedical implants. | - |
dc.language | eng | - |
dc.publisher | Elsevier | - |
dc.relation.ispartof | Surfaces and Interfaces | - |
dc.subject | Osteointegration | - |
dc.subject | Plasma sputtering | - |
dc.subject | Polyetheretherketone | - |
dc.subject | Surface modification | - |
dc.title | Plasma bias homopolar sputtering technology and its application to enhance bioactivity of polyetheretherketone surface | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/j.surfin.2024.104249 | - |
dc.identifier.scopus | eid_2-s2.0-85189179135 | - |
dc.identifier.volume | 48 | - |
dc.identifier.eissn | 2468-0230 | - |
dc.identifier.issnl | 2468-0230 | - |