Heating issues in wide-bandgap semiconductor devices

Abstract

Heat presents a limit to the performance of semiconductor devices, especially in power switches and radio frequency (RF) amplifiers, where the limits are constantly being pushed to higher voltages and higher power. This introductory chapter provides an application-oriented overview of heating issues in wide-bandgap semiconductor devices, their impact on device characteristics, and their management approaches. Heat generated during device operation impacts device maximum operation current density, carrier mobility, current collapse, reliability, robustness, and maximum operation junction temperature. With research advancing in the field of power and RF electronics, many topics for managing heating issues within devices have gained traction. The increased availability and improved growth techniques for high thermal conductivity dielectrics and substrates have allowed for enhanced heat dissipation and mitigation during device operation. Advanced device designs and architectures have allowed for spatially distributed electric field and current and thereby alleviated hot spots within a device. Lastly, improved electronics packaging with new materials and cooling approaches can enable effective heat extraction from semiconductor devices.