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Article: Defects vibrations engineering for enhancing interfacial thermal transport in polymer composites

TitleDefects vibrations engineering for enhancing interfacial thermal transport in polymer composites
Authors
Issue Date24-Jan-2025
PublisherAmerican Association for the Advancement of Science
Citation
Science Advances, 2025, v. 11, n. 4 How to Cite?
AbstractTo push upper boundaries of thermal conductivity in polymer composites, understanding of thermal transport mechanisms is crucial. Despite extensive simulations, systematic experimental investigation on thermal transport in polymer composites is limited. To better understand thermal transport processes, we design polymer composites with perfect fillers (graphite) and defective fillers (graphite oxide), using polyvinyl alcohol (PVA) as a matrix model. Measured thermal conductivities of ∼1.38 ± 0.22 W m-1 K-1 in PVA/defective filler composites is higher than those of ∼0.86 ± 0.21 W m-1 K-1 in PVA/perfect filler composites, while measured thermal conductivities in defective fillers are lower than those of perfect fillers. We identify how thermal transport occurs across heterogeneous interfaces. Thermal transport measurements, neutron scattering, quantum mechanical modeling, and molecular dynamics simulations reveal that vibrational coupling between PVA and defective fillers at PVA/filler interfaces enhances thermal conductivity, suggesting that defects in polymer composites improve thermal transport by promoting this vibrational coupling.
Persistent Identifierhttp://hdl.handle.net/10722/362360

 

DC FieldValueLanguage
dc.contributor.authorZhou, Yijie-
dc.contributor.authorCiarla, Robert-
dc.contributor.authorBoonkird, Artittaya-
dc.contributor.authorRaza, Saqlain-
dc.contributor.authorNguyen, Thanh-
dc.contributor.authorZhou, Jiawei-
dc.contributor.authorOsti, Naresh C.-
dc.contributor.authorMamontov, Eugene-
dc.contributor.authorJiang, Zhang-
dc.contributor.authorZuo, Xiaobing-
dc.contributor.authorRanasinghe, Jeewan-
dc.contributor.authorHu, Weiguo-
dc.contributor.authorScott, Brendan-
dc.contributor.authorChen, Jihua-
dc.contributor.authorHensley, Dale K.-
dc.contributor.authorHuang, Shengxi-
dc.contributor.authorLiu, Jun-
dc.contributor.authorLi, Mingda-
dc.contributor.authorXu, Yanfei-
dc.date.accessioned2025-09-23T00:31:00Z-
dc.date.available2025-09-23T00:31:00Z-
dc.date.issued2025-01-24-
dc.identifier.citationScience Advances, 2025, v. 11, n. 4-
dc.identifier.urihttp://hdl.handle.net/10722/362360-
dc.description.abstractTo push upper boundaries of thermal conductivity in polymer composites, understanding of thermal transport mechanisms is crucial. Despite extensive simulations, systematic experimental investigation on thermal transport in polymer composites is limited. To better understand thermal transport processes, we design polymer composites with perfect fillers (graphite) and defective fillers (graphite oxide), using polyvinyl alcohol (PVA) as a matrix model. Measured thermal conductivities of ∼1.38 ± 0.22 W m-1 K-1 in PVA/defective filler composites is higher than those of ∼0.86 ± 0.21 W m-1 K-1 in PVA/perfect filler composites, while measured thermal conductivities in defective fillers are lower than those of perfect fillers. We identify how thermal transport occurs across heterogeneous interfaces. Thermal transport measurements, neutron scattering, quantum mechanical modeling, and molecular dynamics simulations reveal that vibrational coupling between PVA and defective fillers at PVA/filler interfaces enhances thermal conductivity, suggesting that defects in polymer composites improve thermal transport by promoting this vibrational coupling.-
dc.languageeng-
dc.publisherAmerican Association for the Advancement of Science-
dc.relation.ispartofScience Advances-
dc.rightsThis work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.-
dc.titleDefects vibrations engineering for enhancing interfacial thermal transport in polymer composites-
dc.typeArticle-
dc.identifier.doi10.1126/sciadv.adp6516-
dc.identifier.pmid39841839-
dc.identifier.scopuseid_2-s2.0-85216607609-
dc.identifier.volume11-
dc.identifier.issue4-
dc.identifier.eissn2375-2548-
dc.identifier.issnl2375-2548-

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