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Article: Indentation size dependent plastic deformation of nanocrystalline and ultrafine grain Cu films at nanoscale

TitleIndentation size dependent plastic deformation of nanocrystalline and ultrafine grain Cu films at nanoscale
Authors
Cao, ZHLu, HMMeng, XKNgan, AHW
Issue Date2009
PublisherAmerican Institute of Physics. The Journal's web site is located at http://jap.aip.org/jap/staff.jsp
Citation
Journal of Applied Physics, 2009, v. 105 n. 8, article no. 083521 How to Cite?
DOI: http://dx.doi.org/10.1063/1.3110087
AbstractNanoindentation creep tests were performed in the depth range from about 28 to 190 nm on nanocrystalline (NC) and ultrafine grain (UFG) Cu films. Pronounced indentation size effects on hardness, creep strain rate (ε̇), and strain rate sensitivity (m c) are observed. Both ε̇ and mc are dependent not only on contact depth (h c) but also on grain size. The experiment results and analysis support that the creep deformation of NC and UFG Cu is dominated by grain-boundary-mediated process and diffusion along the interface of tip sample, respectively, under a critical h c and dislocation-mediated process begin to work as h c increases further. © 2009 American Institute of Physics.
Persistent Identifierhttp://hdl.handle.net/10722/59092
ISSN
0021-8979
2022 Impact Factor: 3.2
2020 SCImago Journal Rankings: 0.699
ISI Accession Number ID
WOS:000268064700047
Funding AgencyGrant Number
State Key Program for Basic Research of China2004CB619305
Natural Science Foundation of China50571044
50831004
Postdoctoral Science Foundation of China200801370
Funding Information:

This work was supported by the State Key Program for Basic Research of China (Contract No. 2004CB619305), the Natural Science Foundation of China (Contract Nos. 50571044 and 50831004), and the Special Funding of Postdoctoral Science Foundation of China (Contract No. 200801370).

References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorCao, ZHen_HK
dc.contributor.authorLu, HMen_HK
dc.contributor.authorMeng, XKen_HK
dc.contributor.authorNgan, AHWen_HK
dc.date.accessioned2010-05-31T03:42:44Z-
dc.date.available2010-05-31T03:42:44Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal of Applied Physics, 2009, v. 105 n. 8, article no. 083521-
dc.identifier.issn0021-8979en_HK
dc.identifier.urihttp://hdl.handle.net/10722/59092-
dc.description.abstractNanoindentation creep tests were performed in the depth range from about 28 to 190 nm on nanocrystalline (NC) and ultrafine grain (UFG) Cu films. Pronounced indentation size effects on hardness, creep strain rate (ε̇), and strain rate sensitivity (m c) are observed. Both ε̇ and mc are dependent not only on contact depth (h c) but also on grain size. The experiment results and analysis support that the creep deformation of NC and UFG Cu is dominated by grain-boundary-mediated process and diffusion along the interface of tip sample, respectively, under a critical h c and dislocation-mediated process begin to work as h c increases further. © 2009 American Institute of Physics.en_HK
dc.languageengen_HK
dc.publisherAmerican Institute of Physics. The Journal's web site is located at http://jap.aip.org/jap/staff.jspen_HK
dc.relation.ispartofJournal of Applied Physicsen_HK
dc.titleIndentation size dependent plastic deformation of nanocrystalline and ultrafine grain Cu films at nanoscaleen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0021-8979&volume=105&spage=083521&epage=1 &date=2009&atitle=Indentation+size+dependent+plastic+deformation+of+nanocrystalline+and+ultrafine+grain+Cu+films+at+nanoscaleen_HK
dc.identifier.emailNgan, AHW:hwngan@hkucc.hku.hken_HK
dc.identifier.authorityNgan, AHW=rp00225en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1063/1.3110087en_HK
dc.identifier.scopuseid_2-s2.0-65449181535en_HK
dc.identifier.hkuros155451en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-65449181535&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume105en_HK
dc.identifier.issue8en_HK
dc.identifier.spagearticle no. 083521-
dc.identifier.epagearticle no. 083521-
dc.identifier.isiWOS:000268064700047-
dc.publisher.placeUnited Statesen_HK
dc.identifier.scopusauthoridCao, ZH=25654525400en_HK
dc.identifier.scopusauthoridLu, HM=22734797300en_HK
dc.identifier.scopusauthoridMeng, XK=7401630110en_HK
dc.identifier.scopusauthoridNgan, AHW=7006827202en_HK
dc.identifier.issnl0021-8979-

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