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Article: Synthesis and thermal conductivity of Cu2O nanofluids

TitleSynthesis and thermal conductivity of Cu2O nanofluids
Authors
Wei, XZhu, HKong, TWang, L
KeywordsChemical solution method (CSM)
Conductivity enhancement
Cu2O nanoparticles
Nanofluids
Thermal conductivity
Issue Date2009
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/ijhmt
Citation
International Journal Of Heat And Mass Transfer, 2009, v. 52 n. 19-20, p. 4371-4374 How to Cite?
DOI: http://dx.doi.org/10.1016/j.ijheatmasstransfer.2009.03.073
AbstractWe apply the chemical solution method to synthesize Cu2O nanofluids: suspensions of cuprous-oxide (Cu2O) nanoparticles in water, and experimentally study the effect of reactant molar concentration and nanofluid temperature on the thermal conductivity. Substantial conductivity enhancement up to 24% is achievable with the synthesized nanofluids. The nanoparticle shape is variable by adjusting some synthesis parameters. The thermal conductivity shows both sensitivity and nonlinearity to the reactant molar concentration and the nanofluid temperature. © 2009 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/59119
ISSN
0017-9310
2023 Impact Factor: 5.0
2023 SCImago Journal Rankings: 1.224
ISI Accession Number ID
WOS:000268948000025
Funding AgencyGrant Number
Research Grants Council of Hong KongGRF717508
Funding Information:

The authors are indebted to the two anonymous referees for their critical reviews and constructive comments/suggestions on the original manuscript. The financial support from the Research Grants Council of Hong Kong (GRF717508) is gratefully acknowledged.

References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorWei, Xen_HK
dc.contributor.authorZhu, Hen_HK
dc.contributor.authorKong, Ten_HK
dc.contributor.authorWang, Len_HK
dc.date.accessioned2010-05-31T03:43:12Z-
dc.date.available2010-05-31T03:43:12Z-
dc.date.issued2009en_HK
dc.identifier.citationInternational Journal Of Heat And Mass Transfer, 2009, v. 52 n. 19-20, p. 4371-4374en_HK
dc.identifier.issn0017-9310en_HK
dc.identifier.urihttp://hdl.handle.net/10722/59119-
dc.description.abstractWe apply the chemical solution method to synthesize Cu2O nanofluids: suspensions of cuprous-oxide (Cu2O) nanoparticles in water, and experimentally study the effect of reactant molar concentration and nanofluid temperature on the thermal conductivity. Substantial conductivity enhancement up to 24% is achievable with the synthesized nanofluids. The nanoparticle shape is variable by adjusting some synthesis parameters. The thermal conductivity shows both sensitivity and nonlinearity to the reactant molar concentration and the nanofluid temperature. © 2009 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/ijhmten_HK
dc.relation.ispartofInternational Journal of Heat and Mass Transferen_HK
dc.subjectChemical solution method (CSM)en_HK
dc.subjectConductivity enhancementen_HK
dc.subjectCu2O nanoparticlesen_HK
dc.subjectNanofluidsen_HK
dc.subjectThermal conductivityen_HK
dc.titleSynthesis and thermal conductivity of Cu2O nanofluidsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0017-9310&volume=52&spage=4371&epage=4374&date=2009&atitle=Synthesis+and+thermal+conductivity+of+Cu2O+nanofluidsen_HK
dc.identifier.emailWang, L:lqwang@hkucc.hku.hken_HK
dc.identifier.authorityWang, L=rp00184en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/j.ijheatmasstransfer.2009.03.073en_HK
dc.identifier.scopuseid_2-s2.0-67650097152en_HK
dc.identifier.hkuros164911en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-67650097152&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume52en_HK
dc.identifier.issue19-20en_HK
dc.identifier.spage4371en_HK
dc.identifier.epage4374en_HK
dc.identifier.isiWOS:000268948000025-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridWei, X=23669842200en_HK
dc.identifier.scopusauthoridZhu, H=8445468300en_HK
dc.identifier.scopusauthoridKong, T=26867917800en_HK
dc.identifier.scopusauthoridWang, L=35235288500en_HK
dc.identifier.citeulike5000408-
dc.identifier.issnl0017-9310-

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