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Conference Paper: A novel surface modified biodegradable metallic material for orthopaedic implantation

TitleA novel surface modified biodegradable metallic material for orthopaedic implantation
Authors
Issue Date2008
PublisherHong Kong Institution of Engineers (HKIE).
Citation
The 2008 Hong Kong Biomedical Engineering International Conference (BME 2008), Hong Kong, 23-25 October 2008. In Conference Proceedings, 2008, p. 25 How to Cite?
DescriptionConference Theme: Converging frontiers in biomedical engineering from novel research to patient benefits
Oral Presentation - Concurrent Session E: Biomaterials and Tissue Engineering (2)
Persistent Identifierhttp://hdl.handle.net/10722/62574
ISBN

 

DC FieldValueLanguage
dc.contributor.authorWong, HM-
dc.contributor.authorYeung, KWK-
dc.contributor.authorLam, KO-
dc.contributor.authorChu, PK-
dc.contributor.authorLuk, KDK-
dc.contributor.authorCheung, KMC-
dc.date.accessioned2010-07-13T04:04:15Z-
dc.date.available2010-07-13T04:04:15Z-
dc.date.issued2008-
dc.identifier.citationThe 2008 Hong Kong Biomedical Engineering International Conference (BME 2008), Hong Kong, 23-25 October 2008. In Conference Proceedings, 2008, p. 25-
dc.identifier.isbn9789627619352-
dc.identifier.urihttp://hdl.handle.net/10722/62574-
dc.descriptionConference Theme: Converging frontiers in biomedical engineering from novel research to patient benefits-
dc.descriptionOral Presentation - Concurrent Session E: Biomaterials and Tissue Engineering (2)-
dc.languageeng-
dc.publisherHong Kong Institution of Engineers (HKIE).-
dc.relation.ispartofBME 2008: Hong Kong Biomedical Engineering International Conference Proceedings-
dc.titleA novel surface modified biodegradable metallic material for orthopaedic implantation-
dc.typeConference_Paper-
dc.identifier.emailYeung, KWK: wkkyeung@hkucc.hku.hk-
dc.identifier.emailLuk, KDK: hrmoldk@hkucc.hku.hk-
dc.identifier.emailCheung, KMC: cheungmc@hku.hk-
dc.identifier.authorityYeung, KWK=rp00309-
dc.identifier.authorityLuk, KDK=rp00333-
dc.identifier.authorityCheung, KMC=rp00387-
dc.identifier.hkuros166316-
dc.identifier.hkuros166236-
dc.identifier.spage25-
dc.identifier.epage25-
dc.publisher.placeHong Kong-

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