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- Publisher Website: 10.1016/j.engfracmech.2004.03.005
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Article: Stress intensity factors for penny-shaped cracks perpendicular to graded interfacial zone of bonded bi-materials
Title | Stress intensity factors for penny-shaped cracks perpendicular to graded interfacial zone of bonded bi-materials |
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Authors | |
Keywords | Bi-materials Boundary element method Functionally graded materials Generalized Kelvin solution Interface Penny-shaped crack Stress intensity factors |
Issue Date | 2005 |
Publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmech |
Citation | Engineering Fracture Mechanics, 2005, v. 72 n. 1, p. 121-143 How to Cite? |
Abstract | This paper examines the stress intensity factors that are associated with a penny-shaped crack perpendicular to the interface of a bi-material bonded with a graded interfacial zone. Elastic modulus of the graded interfacial zone is assumed to be an exponential function of the depth. The stress intensity factors are calculated numerically using a so-called generalized Kelvin solution based boundary element method. Three cases of normal or shear tractions acting on the crack surfaces are examined. Values of the stress intensity factors are examined by taking into account the effects of the following four parameters: (a) the crack front position; (b) the non-homogeneity parameter of the graded interfacial zone; (c) the crack distance to the graded interfacial zone; and (d) the graded interfacial zone thickness. The numerical results are compared well with existing solutions under some degenerated conditions. These results are useful to furthering our knowledge on fracture behavior of bi-material systems with or without a graded interfacial zone. © 2004 Elsevier Ltd. All rights reserved. |
Persistent Identifier | http://hdl.handle.net/10722/71149 |
ISSN | 2023 Impact Factor: 4.7 2023 SCImago Journal Rankings: 1.232 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Xiao, HT | en_HK |
dc.contributor.author | Yue, ZQ | en_HK |
dc.contributor.author | Tham, LG | en_HK |
dc.contributor.author | Chen, YR | en_HK |
dc.date.accessioned | 2010-09-06T06:29:21Z | - |
dc.date.available | 2010-09-06T06:29:21Z | - |
dc.date.issued | 2005 | en_HK |
dc.identifier.citation | Engineering Fracture Mechanics, 2005, v. 72 n. 1, p. 121-143 | en_HK |
dc.identifier.issn | 0013-7944 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/71149 | - |
dc.description.abstract | This paper examines the stress intensity factors that are associated with a penny-shaped crack perpendicular to the interface of a bi-material bonded with a graded interfacial zone. Elastic modulus of the graded interfacial zone is assumed to be an exponential function of the depth. The stress intensity factors are calculated numerically using a so-called generalized Kelvin solution based boundary element method. Three cases of normal or shear tractions acting on the crack surfaces are examined. Values of the stress intensity factors are examined by taking into account the effects of the following four parameters: (a) the crack front position; (b) the non-homogeneity parameter of the graded interfacial zone; (c) the crack distance to the graded interfacial zone; and (d) the graded interfacial zone thickness. The numerical results are compared well with existing solutions under some degenerated conditions. These results are useful to furthering our knowledge on fracture behavior of bi-material systems with or without a graded interfacial zone. © 2004 Elsevier Ltd. All rights reserved. | en_HK |
dc.language | eng | en_HK |
dc.publisher | Pergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmech | en_HK |
dc.relation.ispartof | Engineering Fracture Mechanics | en_HK |
dc.subject | Bi-materials | en_HK |
dc.subject | Boundary element method | en_HK |
dc.subject | Functionally graded materials | en_HK |
dc.subject | Generalized Kelvin solution | en_HK |
dc.subject | Interface | en_HK |
dc.subject | Penny-shaped crack | en_HK |
dc.subject | Stress intensity factors | en_HK |
dc.title | Stress intensity factors for penny-shaped cracks perpendicular to graded interfacial zone of bonded bi-materials | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0013-7944&volume=72&spage=121&epage=143&date=2004&atitle=Stress+intensity+factors+for+penny-shaped+cracks+perpendicular+to+graded+interfacial+zone+of+bonded+bi-materials | en_HK |
dc.identifier.email | Yue, ZQ:yueqzq@hkucc.hku.hk | en_HK |
dc.identifier.email | Tham, LG:hrectlg@hkucc.hku.hk | en_HK |
dc.identifier.authority | Yue, ZQ=rp00209 | en_HK |
dc.identifier.authority | Tham, LG=rp00176 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1016/j.engfracmech.2004.03.005 | en_HK |
dc.identifier.scopus | eid_2-s2.0-10044232854 | en_HK |
dc.identifier.hkuros | 91820 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-10044232854&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 72 | en_HK |
dc.identifier.issue | 1 | en_HK |
dc.identifier.spage | 121 | en_HK |
dc.identifier.epage | 143 | en_HK |
dc.identifier.isi | WOS:000224447900006 | - |
dc.publisher.place | United Kingdom | en_HK |
dc.identifier.scopusauthorid | Xiao, HT=7401565578 | en_HK |
dc.identifier.scopusauthorid | Yue, ZQ=7102782735 | en_HK |
dc.identifier.scopusauthorid | Tham, LG=7006213628 | en_HK |
dc.identifier.scopusauthorid | Chen, YR=22978389000 | en_HK |
dc.identifier.citeulike | 7350530 | - |
dc.identifier.issnl | 0013-7944 | - |