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Article: Numerical modeling of interactions between a macro-crack and a cluster of micro-defects

TitleNumerical modeling of interactions between a macro-crack and a cluster of micro-defects
Authors
Soh, AKYang, CH
KeywordsComplex potentials
Conformal mapping
Finite element
Hybrid displacement method
Macro-crack
Micro-defects
Issue Date2004
PublisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmech
Citation
Engineering Fracture Mechanics, 2004, v. 71 n. 2, p. 193-217 How to Cite?
DOI: http://dx.doi.org/10.1016/S0013-7944(03)00097-3
AbstractThe interactions between a macro-crack and a cluster of micro-defects are studied numerically by using a series of special finite elements each containing a defect. These special finite elements, which contain defects such as holes, cracks, and inhomogeneities, are developed based on the hybrid displacement, complex potential and conformal mapping techniques. These hybrid-type elements can be used together with the conventional finite elements without any difficulty. Thus, simple finite element models can be devised to study the interactions between a macro-crack and a cluster of micro-defects. In this paper, the mathematical and finite element modeling procedures for the study of the above-mentioned problems are presented. © 2003 Elsevier Ltd. All rights reserved.
Persistent Identifierhttp://hdl.handle.net/10722/76166
ISSN
0013-7944
2023 Impact Factor: 4.7
2023 SCImago Journal Rankings: 1.232
ISI Accession Number ID
WOS:000186099000003
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorSoh, AKen_HK
dc.contributor.authorYang, CHen_HK
dc.date.accessioned2010-09-06T07:18:17Z-
dc.date.available2010-09-06T07:18:17Z-
dc.date.issued2004en_HK
dc.identifier.citationEngineering Fracture Mechanics, 2004, v. 71 n. 2, p. 193-217en_HK
dc.identifier.issn0013-7944en_HK
dc.identifier.urihttp://hdl.handle.net/10722/76166-
dc.description.abstractThe interactions between a macro-crack and a cluster of micro-defects are studied numerically by using a series of special finite elements each containing a defect. These special finite elements, which contain defects such as holes, cracks, and inhomogeneities, are developed based on the hybrid displacement, complex potential and conformal mapping techniques. These hybrid-type elements can be used together with the conventional finite elements without any difficulty. Thus, simple finite element models can be devised to study the interactions between a macro-crack and a cluster of micro-defects. In this paper, the mathematical and finite element modeling procedures for the study of the above-mentioned problems are presented. © 2003 Elsevier Ltd. All rights reserved.en_HK
dc.languageengen_HK
dc.publisherPergamon. The Journal's web site is located at http://www.elsevier.com/locate/engfracmechen_HK
dc.relation.ispartofEngineering Fracture Mechanicsen_HK
dc.subjectComplex potentialsen_HK
dc.subjectConformal mappingen_HK
dc.subjectFinite elementen_HK
dc.subjectHybrid displacement methoden_HK
dc.subjectMacro-cracken_HK
dc.subjectMicro-defectsen_HK
dc.titleNumerical modeling of interactions between a macro-crack and a cluster of micro-defectsen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0013-7944&volume=71&issue=2&spage=193&epage=217&date=2004&atitle=Numerical+modeling+of+interactions+between+a+macro-crack+and+a+cluster+of+micro-defectsen_HK
dc.identifier.emailSoh, AK:aksoh@hkucc.hku.hken_HK
dc.identifier.authoritySoh, AK=rp00170en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/S0013-7944(03)00097-3en_HK
dc.identifier.scopuseid_2-s2.0-0142184824en_HK
dc.identifier.hkuros88991en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0142184824&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume71en_HK
dc.identifier.issue2en_HK
dc.identifier.spage193en_HK
dc.identifier.epage217en_HK
dc.identifier.isiWOS:000186099000003-
dc.publisher.placeUnited Kingdomen_HK
dc.identifier.scopusauthoridSoh, AK=7006795203en_HK
dc.identifier.scopusauthoridYang, CH=8731219500en_HK
dc.identifier.issnl0013-7944-

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