File Download
There are no files associated with this item.
Supplementary
-
Citations:
- Scopus: 0
- Appears in Collections:
Article: Mode III interfacial edge crack in a magnetoelectroelastic bimaterial
Title | Mode III interfacial edge crack in a magnetoelectroelastic bimaterial |
---|---|
Authors | |
Keywords | Bimaterial Intensity factors Interfacial crack Magnetoelectroelasticity |
Issue Date | 2004 |
Publisher | Trans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net |
Citation | Key Engineering Materials, 2004, v. 261-263 I, p. 393-398 How to Cite? |
Abstract | This paper deals with a Mode III interfacial edge crack in a magnetoelectroelastic bimaterial subjected to line singularities such as an out-of-plane line force, a line electric charge, a line magnetic charge and a straight screw dislocation. The surfaces (including crack surfaces) of the bimateral are assumed to be electrically open and magnetically closed. The closed-form analytical solution to the problem is obtained by employing the complex variable approach in conjunction with the conformal mapping technique. The intensity factors of stress, electric displacement and magnetic induction are given explicitly. The obtained results can be used as the Green's function to solve more complicated problems. |
Persistent Identifier | http://hdl.handle.net/10722/76185 |
ISSN | 2023 SCImago Journal Rankings: 0.172 |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Soh, AK | en_HK |
dc.contributor.author | Liu, JX | en_HK |
dc.date.accessioned | 2010-09-06T07:18:27Z | - |
dc.date.available | 2010-09-06T07:18:27Z | - |
dc.date.issued | 2004 | en_HK |
dc.identifier.citation | Key Engineering Materials, 2004, v. 261-263 I, p. 393-398 | en_HK |
dc.identifier.issn | 1013-9826 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/76185 | - |
dc.description.abstract | This paper deals with a Mode III interfacial edge crack in a magnetoelectroelastic bimaterial subjected to line singularities such as an out-of-plane line force, a line electric charge, a line magnetic charge and a straight screw dislocation. The surfaces (including crack surfaces) of the bimateral are assumed to be electrically open and magnetically closed. The closed-form analytical solution to the problem is obtained by employing the complex variable approach in conjunction with the conformal mapping technique. The intensity factors of stress, electric displacement and magnetic induction are given explicitly. The obtained results can be used as the Green's function to solve more complicated problems. | en_HK |
dc.language | eng | en_HK |
dc.publisher | Trans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net | en_HK |
dc.relation.ispartof | Key Engineering Materials | en_HK |
dc.rights | Key Engineering Materials. Copyright © Trans Tech Publications Ltd. | en_HK |
dc.subject | Bimaterial | en_HK |
dc.subject | Intensity factors | en_HK |
dc.subject | Interfacial crack | en_HK |
dc.subject | Magnetoelectroelasticity | en_HK |
dc.title | Mode III interfacial edge crack in a magnetoelectroelastic bimaterial | en_HK |
dc.type | Article | en_HK |
dc.identifier.openurl | http://library.hku.hk:4550/resserv?sid=HKU:IR&issn=1013-9826&volume=261-263&spage=393&epage=398&date=2004&atitle=Mode+III+interfacial+edge+crack+in+a+magnetoelectroelastic+bimaterial | en_HK |
dc.identifier.email | Soh, AK:aksoh@hkucc.hku.hk | en_HK |
dc.identifier.authority | Soh, AK=rp00170 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.scopus | eid_2-s2.0-3142731464 | en_HK |
dc.identifier.hkuros | 88995 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-3142731464&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 261-263 | en_HK |
dc.identifier.issue | I | en_HK |
dc.identifier.spage | 393 | en_HK |
dc.identifier.epage | 398 | en_HK |
dc.publisher.place | Switzerland | en_HK |
dc.identifier.scopusauthorid | Soh, AK=7006795203 | en_HK |
dc.identifier.scopusauthorid | Liu, JX=36063914500 | en_HK |
dc.identifier.issnl | 1013-9826 | - |