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Article: The Adhesion of Copper Films Coated on Silicon and Glass Substrates

TitleThe Adhesion of Copper Films Coated on Silicon and Glass Substrates
Authors
Chen, MGao, J
Issue Date2000
PublisherWorld Scientific Publishing Co Pte Ltd. The Journal's web site is located at http://www.worldscinet.com/mplb/mplb.shtml
Citation
Modern Physics Letters B, 2000, v. 14, p. 103-108 How to Cite?
DOI: http://dx.doi.org/10.1016/S0217-9849(00)00016-1
Persistent Identifierhttp://hdl.handle.net/10722/80392
ISSN
0217-9849
2021 Impact Factor: 1.948
2020 SCImago Journal Rankings: 0.293

 

DC FieldValueLanguage
dc.contributor.authorChen, Men_HK
dc.contributor.authorGao, Jen_HK
dc.date.accessioned2010-09-06T08:05:57Z-
dc.date.available2010-09-06T08:05:57Z-
dc.date.issued2000en_HK
dc.identifier.citationModern Physics Letters B, 2000, v. 14, p. 103-108en_HK
dc.identifier.issn0217-9849en_HK
dc.identifier.urihttp://hdl.handle.net/10722/80392-
dc.languageengen_HK
dc.publisherWorld Scientific Publishing Co Pte Ltd. The Journal's web site is located at http://www.worldscinet.com/mplb/mplb.shtmlen_HK
dc.relation.ispartofModern Physics Letters Ben_HK
dc.titleThe Adhesion of Copper Films Coated on Silicon and Glass Substratesen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0217-9849&volume=14&spage=103&epage=108&date=2000&atitle=The+Adhesion+of+Copper+Films+Coated+on+Silicon+and+Glass+Substratesen_HK
dc.identifier.emailGao, J: jugao@hku.hken_HK
dc.identifier.authorityGao, J=rp00699en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1016/S0217-9849(00)00016-1-
dc.identifier.scopuseid_2-s2.0-0034628390-
dc.identifier.hkuros48724en_HK
dc.identifier.issnl0217-9849-

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