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Conference Paper: Investigation of EBC polymer coating using a monoenergetic positron beam

TitleInvestigation of EBC polymer coating using a monoenergetic positron beam
Authors
Weng, HMFan, YMYie, BJZhou, XYDu, JFHan, RDMa, CGLing, CC
KeywordsDoppler broadening
Electron Beam Cured (EBC) coating
Epoxy-acrylates resin
Slow positron beam
Issue Date2001
PublisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.net
Citation
Materials Science Forum, 2001, v. 363-365, p. 508-510 How to Cite?
AbstractElectron Beam Cured (EBC) coating of epoxy-acrylate resin as oligomer has been used in many areas. The microstructure of the coating is closely correlated with the molecular structure of the components and radiation dose during curing. The curves of S parameter vs. incident energy of the positrons were measured to study the polymerization and crosslinking induced during electron irradiation curing. The bulk S-parameter (S b) and the effective diffusion length (L eff) were used to characterize the epoxy acrylate coating. The correlations of S b and L eff with the content and molecular structure of reactive diluents, and irradiation dose are discussed.
Persistent Identifierhttp://hdl.handle.net/10722/80511
ISSN
0255-5476
2023 SCImago Journal Rankings: 0.195
ISI Accession Number ID
WOS:000170202400148
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorWeng, HMen_HK
dc.contributor.authorFan, YMen_HK
dc.contributor.authorYie, BJen_HK
dc.contributor.authorZhou, XYen_HK
dc.contributor.authorDu, JFen_HK
dc.contributor.authorHan, RDen_HK
dc.contributor.authorMa, CGen_HK
dc.contributor.authorLing, CCen_HK
dc.date.accessioned2010-09-06T08:07:15Z-
dc.date.available2010-09-06T08:07:15Z-
dc.date.issued2001en_HK
dc.identifier.citationMaterials Science Forum, 2001, v. 363-365, p. 508-510en_HK
dc.identifier.issn0255-5476en_HK
dc.identifier.urihttp://hdl.handle.net/10722/80511-
dc.description.abstractElectron Beam Cured (EBC) coating of epoxy-acrylate resin as oligomer has been used in many areas. The microstructure of the coating is closely correlated with the molecular structure of the components and radiation dose during curing. The curves of S parameter vs. incident energy of the positrons were measured to study the polymerization and crosslinking induced during electron irradiation curing. The bulk S-parameter (S b) and the effective diffusion length (L eff) were used to characterize the epoxy acrylate coating. The correlations of S b and L eff with the content and molecular structure of reactive diluents, and irradiation dose are discussed.en_HK
dc.languageengen_HK
dc.publisherTrans Tech Publications Ltd. The Journal's web site is located at http://www.scientific.neten_HK
dc.relation.ispartofMaterials Science Forumen_HK
dc.rightsMaterials Science Forum. Copyright © Trans Tech Publications Ltd.en_HK
dc.subjectDoppler broadeningen_HK
dc.subjectElectron Beam Cured (EBC) coatingen_HK
dc.subjectEpoxy-acrylates resinen_HK
dc.subjectSlow positron beamen_HK
dc.titleInvestigation of EBC polymer coating using a monoenergetic positron beamen_HK
dc.typeConference_Paperen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0255-5476&volume=363-365&spage=508&epage=510&date=2001&atitle=Investigation+of+EBC+Polymer+Coating+Using+a+Monoenergetic+Positron+Beamen_HK
dc.identifier.emailLing, CC: ccling@hkucc.hku.hken_HK
dc.identifier.authorityLing, CC=rp00747en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-0035007248en_HK
dc.identifier.hkuros63715en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-0035007248&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume363-365en_HK
dc.identifier.spage508en_HK
dc.identifier.epage510en_HK
dc.identifier.isiWOS:000170202400148-
dc.publisher.placeSwitzerlanden_HK
dc.identifier.scopusauthoridWeng, HM=7102468725en_HK
dc.identifier.scopusauthoridFan, YM=7403491929en_HK
dc.identifier.scopusauthoridYie, BJ=35335511300en_HK
dc.identifier.scopusauthoridZhou, XY=7410093961en_HK
dc.identifier.scopusauthoridDu, JF=7402575506en_HK
dc.identifier.scopusauthoridHan, RD=7202457519en_HK
dc.identifier.scopusauthoridMa, CG=24464250700en_HK
dc.identifier.scopusauthoridLing, CC=13310239300en_HK
dc.identifier.issnl0255-5476-

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