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Conference Paper: On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring
Title | On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring |
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Authors | |
Keywords | Impedance Piezoelectric Wafer Active Sensors Structural Health Monitoring |
Issue Date | 2006 |
Publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedings |
Citation | SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, San Diego, CA, 26 February - 2 March 2006. In Proceedings of SPIE - The International Society for Optical Engineering, 2006, v. 6174 How to Cite? |
Abstract | Structural health monitoring (SHM) is important for reducing maintenance costs while increasing safety and reliability. Piezoelectric wafer active sensors (PWAS) used in SHM applications are able to detect structural damage using Lamb waves. PWAS are small, lightweight, unobtrusive, and inexpensive. PWAS achieve direct transduction between electric and elastic wave energies. PWAS are essential elements in the Lamb-wave SHM with pitch-catch, pulse-echo, phased array system and electromechanical impedance methods. This paper starts with the state of the art on the impedance method for PWAS applications. Then, finite element impedance model for free and bonded PWAS with different sizes and shapes will be given. Experiments showed that the real part and imaginary part of PWAS had different usage. Applications of impedance-based structural health monitoring indicate impedance method as a good candidate for damage detection and sensor durability verification for SHM smart sensor. |
Persistent Identifier | http://hdl.handle.net/10722/90785 |
ISSN | 2023 SCImago Journal Rankings: 0.152 |
References |
DC Field | Value | Language |
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dc.contributor.author | Lin, B | en_HK |
dc.contributor.author | Giurgiutiu, V | en_HK |
dc.date.accessioned | 2010-09-17T10:08:21Z | - |
dc.date.available | 2010-09-17T10:08:21Z | - |
dc.date.issued | 2006 | en_HK |
dc.identifier.citation | SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, San Diego, CA, 26 February - 2 March 2006. In Proceedings of SPIE - The International Society for Optical Engineering, 2006, v. 6174 | en_HK |
dc.identifier.issn | 0277-786X | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/90785 | - |
dc.description.abstract | Structural health monitoring (SHM) is important for reducing maintenance costs while increasing safety and reliability. Piezoelectric wafer active sensors (PWAS) used in SHM applications are able to detect structural damage using Lamb waves. PWAS are small, lightweight, unobtrusive, and inexpensive. PWAS achieve direct transduction between electric and elastic wave energies. PWAS are essential elements in the Lamb-wave SHM with pitch-catch, pulse-echo, phased array system and electromechanical impedance methods. This paper starts with the state of the art on the impedance method for PWAS applications. Then, finite element impedance model for free and bonded PWAS with different sizes and shapes will be given. Experiments showed that the real part and imaginary part of PWAS had different usage. Applications of impedance-based structural health monitoring indicate impedance method as a good candidate for damage detection and sensor durability verification for SHM smart sensor. | en_HK |
dc.language | eng | en_HK |
dc.publisher | S P I E - International Society for Optical Engineering. The Journal's web site is located at http://www.spie.org/app/Publications/index.cfm?fuseaction=proceedings | en_HK |
dc.relation.ispartof | Proceedings of SPIE - The International Society for Optical Engineering | en_HK |
dc.subject | Impedance | en_HK |
dc.subject | Piezoelectric Wafer Active Sensors | en_HK |
dc.subject | Structural Health Monitoring | en_HK |
dc.title | On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring | en_HK |
dc.type | Conference_Paper | en_HK |
dc.identifier.email | Lin, B:blin@hku.hk | en_HK |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1117/12.658521 | en_HK |
dc.identifier.scopus | eid_2-s2.0-33745955619 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-33745955619&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 6174 | en_HK |
dc.identifier.issnl | 0277-786X | - |