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Article: Research on the method for measuring ceramic surface residual stresses after grinding

TitleResearch on the method for measuring ceramic surface residual stresses after grinding
Authors
Tian, XYu, ALin, B
KeywordsEngineering Ceramics
Grinding Residual Stress
Measuring Method
Issue Date2001
Citation
Jixie Kexue Yu Jishu/Mechanical Science and Technology, 2001, v. 20 n. 5, p. 7-8+730 How to Cite?
AbstractMeasuring ceramic grinding surface residual stresses by using both corrosion method and polishing method has been proved to be a better method than the X-ray diffraction method. The results of the experiment show that for non-metal oxide ceramics the polishing method can replace X-ray diffraction after avoiding instability of signal and affiliated stresses, and so can the corrosion method after avoiding of polluting.
Persistent Identifierhttp://hdl.handle.net/10722/91140
ISSN
1003-8728

 

DC FieldValueLanguage
dc.contributor.authorTian, Xen_HK
dc.contributor.authorYu, Aen_HK
dc.contributor.authorLin, Ben_HK
dc.date.accessioned2010-09-17T10:13:38Z-
dc.date.available2010-09-17T10:13:38Z-
dc.date.issued2001en_HK
dc.identifier.citationJixie Kexue Yu Jishu/Mechanical Science and Technology, 2001, v. 20 n. 5, p. 7-8+730en_HK
dc.identifier.issn1003-8728en_HK
dc.identifier.urihttp://hdl.handle.net/10722/91140-
dc.description.abstractMeasuring ceramic grinding surface residual stresses by using both corrosion method and polishing method has been proved to be a better method than the X-ray diffraction method. The results of the experiment show that for non-metal oxide ceramics the polishing method can replace X-ray diffraction after avoiding instability of signal and affiliated stresses, and so can the corrosion method after avoiding of polluting.en_HK
dc.languageengen_HK
dc.relation.ispartofJixie Kexue Yu Jishu/Mechanical Science and Technologyen_HK
dc.subjectEngineering Ceramicsen_HK
dc.subjectGrinding Residual Stressen_HK
dc.subjectMeasuring Methoden_HK
dc.titleResearch on the method for measuring ceramic surface residual stresses after grindingen_HK
dc.typeArticleen_HK
dc.identifier.emailLin, B:blin@hku.hken_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.scopuseid_2-s2.0-0035444552en_HK
dc.identifier.volume20en_HK
dc.identifier.issue5en_HK
dc.identifier.spage7en_HK
dc.identifier.epage8+730en_HK
dc.identifier.issnl1003-8728-

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