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Article: Effects of rare earths on properties and microstructures of lead-free solder alloys

TitleEffects of rare earths on properties and microstructures of lead-free solder alloys
Authors
Zhang, LXue, S-BGao, L-LZeng, GSheng, ZChen, YYu, S-L
KeywordsAlloys
Brazing
Cerium
Cerium Alloys
Cerium Compounds
Copper Alloys
Creep
Lead
Mechanical Properties
Microstructure
Soldering Alloys
Welding
Issue Date2009
PublisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0957-4522
Citation
Journal of Materials Science: Materials in Electronics, 2009, v. 20 n. 8, p. 685-694 How to Cite?
DOI: http://dx.doi.org/10.1007/s10854-009-9895-2
AbstractIn order to further enhance the properties of lead-free solder alloys such as SnAgCu, SnAg, SnCu and SnZn, trace amount of rare earths were selected by lots of researchers as alloys addition into these alloys. The enhancement include better wettability, physical properties, creep strength and tensile strength. For Sn3.8Ag0.7Cu bearing rare earths, when the rare earths were La and Ce, the creep-rupture life of solder joints can be remarkably improved, nine times more than that of the original Sn3.8Ag0.7Cu solder joints at room temperature. In addition, creep-rupture lifetime of RE-doped solders increases by over four times for SnAg and seven times for SnCu. This paper summarizes the effects of rare earths on the wettability, mechanical properties, physical behavior and microstructure of a series of lead-free solders. © Springer Science+Business Media, LLC 2009.
Persistent Identifierhttp://hdl.handle.net/10722/92320
ISSN
0957-4522
2023 Impact Factor: 2.8
2023 SCImago Journal Rankings: 0.512
ISI Accession Number ID
WOS:000268241200001
Funding AgencyGrant Number
Nanjing University of Aeronautics and Astronautics20090110
Six Kind Skilled Personnel Project of Jiangsu ProvinceCX07B-087z
Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative PlanCX0713_087z
Funding Information:

The authors greatly appreciate the financial support from the Nanjing University of Aeronautics and Astronautics Undergraduate Scientific Research Innovative(20090110). Six Kind Skilled Personnel Project of Jiangsu Province (CX07B-087z), and the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan(CX0713_087z).

References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorZhang, Len_HK
dc.contributor.authorXue, S-Ben_HK
dc.contributor.authorGao, L-Len_HK
dc.contributor.authorZeng, Gen_HK
dc.contributor.authorSheng, Zen_HK
dc.contributor.authorChen, Yen_HK
dc.contributor.authorYu, S-Len_HK
dc.date.accessioned2010-09-17T10:42:34Z-
dc.date.available2010-09-17T10:42:34Z-
dc.date.issued2009en_HK
dc.identifier.citationJournal of Materials Science: Materials in Electronics, 2009, v. 20 n. 8, p. 685-694en_HK
dc.identifier.issn0957-4522en_HK
dc.identifier.urihttp://hdl.handle.net/10722/92320-
dc.description.abstractIn order to further enhance the properties of lead-free solder alloys such as SnAgCu, SnAg, SnCu and SnZn, trace amount of rare earths were selected by lots of researchers as alloys addition into these alloys. The enhancement include better wettability, physical properties, creep strength and tensile strength. For Sn3.8Ag0.7Cu bearing rare earths, when the rare earths were La and Ce, the creep-rupture life of solder joints can be remarkably improved, nine times more than that of the original Sn3.8Ag0.7Cu solder joints at room temperature. In addition, creep-rupture lifetime of RE-doped solders increases by over four times for SnAg and seven times for SnCu. This paper summarizes the effects of rare earths on the wettability, mechanical properties, physical behavior and microstructure of a series of lead-free solders. © Springer Science+Business Media, LLC 2009.en_HK
dc.languageengen_HK
dc.publisherSpringer New York LLC. The Journal's web site is located at http://springerlink.metapress.com/openurl.asp?genre=journal&issn=0957-4522en_HK
dc.relation.ispartofJournal of Materials Science: Materials in Electronicsen_HK
dc.subjectAlloysen_HK
dc.subjectBrazingen_HK
dc.subjectCeriumen_HK
dc.subjectCerium Alloysen_HK
dc.subjectCerium Compoundsen_HK
dc.subjectCopper Alloysen_HK
dc.subjectCreepen_HK
dc.subjectLeaden_HK
dc.subjectMechanical Propertiesen_HK
dc.subjectMicrostructureen_HK
dc.subjectSoldering Alloysen_HK
dc.subjectWeldingen_HK
dc.titleEffects of rare earths on properties and microstructures of lead-free solder alloysen_HK
dc.typeArticleen_HK
dc.identifier.emailChen, Y:ychenc@hkucc.hku.hken_HK
dc.identifier.authorityChen, Y=rp1318en_HK
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1007/s10854-009-9895-2en_HK
dc.identifier.scopuseid_2-s2.0-67349099560en_HK
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-67349099560&selection=ref&src=s&origin=recordpageen_HK
dc.identifier.volume20en_HK
dc.identifier.issue8en_HK
dc.identifier.spage685en_HK
dc.identifier.epage694en_HK
dc.identifier.eissn1573-482X-
dc.identifier.isiWOS:000268241200001-
dc.identifier.citeulike4453202-
dc.identifier.issnl0957-4522-

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