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Article: Improved TLM link model for reactive circuit components
Title | Improved TLM link model for reactive circuit components |
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Authors | |
Keywords | Circuit simulation Link model Stub model Transmission line model |
Issue Date | 1996 |
Citation | Iee Proceedings: Science, Measurement And Technology, 1996, v. 143 n. 5, p. 341-344 How to Cite? |
Abstract | An improved transmission line modelling (TLM) link model for reactive circuit components is presented. This improved model reduces the propagation delay error in the conventional TLM link model. Consequently the improved model provides significant improvement in accuracy over the conventional link model. Simulation confirms that results obtained from the improved link model are much more accurate than those from the conventional link model. The simulation results also indicate that the improved link model is as accurate as the stub model. © IEE, 1996. |
Persistent Identifier | http://hdl.handle.net/10722/136899 |
ISSN | |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
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dc.contributor.author | Fung, KK | en_HK |
dc.contributor.author | Hui, SYR | en_HK |
dc.date.accessioned | 2011-07-29T02:13:24Z | - |
dc.date.available | 2011-07-29T02:13:24Z | - |
dc.date.issued | 1996 | en_HK |
dc.identifier.citation | Iee Proceedings: Science, Measurement And Technology, 1996, v. 143 n. 5, p. 341-344 | en_HK |
dc.identifier.issn | 1350-2344 | en_HK |
dc.identifier.uri | http://hdl.handle.net/10722/136899 | - |
dc.description.abstract | An improved transmission line modelling (TLM) link model for reactive circuit components is presented. This improved model reduces the propagation delay error in the conventional TLM link model. Consequently the improved model provides significant improvement in accuracy over the conventional link model. Simulation confirms that results obtained from the improved link model are much more accurate than those from the conventional link model. The simulation results also indicate that the improved link model is as accurate as the stub model. © IEE, 1996. | en_HK |
dc.language | eng | en_US |
dc.relation.ispartof | IEE Proceedings: Science, Measurement and Technology | en_HK |
dc.subject | Circuit simulation | en_HK |
dc.subject | Link model | en_HK |
dc.subject | Stub model | en_HK |
dc.subject | Transmission line model | en_HK |
dc.title | Improved TLM link model for reactive circuit components | en_HK |
dc.type | Article | en_HK |
dc.identifier.email | Hui, SYR:ronhui@eee.hku.hk | en_HK |
dc.identifier.authority | Hui, SYR=rp01510 | en_HK |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.scopus | eid_2-s2.0-0030235190 | en_HK |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-0030235190&selection=ref&src=s&origin=recordpage | en_HK |
dc.identifier.volume | 143 | en_HK |
dc.identifier.issue | 5 | en_HK |
dc.identifier.spage | 341 | en_HK |
dc.identifier.epage | 344 | en_HK |
dc.identifier.isi | WOS:A1996VJ64500013 | - |
dc.identifier.scopusauthorid | Fung, KK=7202934759 | en_HK |
dc.identifier.scopusauthorid | Hui, SYR=7202831744 | en_HK |
dc.identifier.issnl | 1350-2344 | - |