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  Patent History
  • Application
    US /797621 2007-05-04
  • Publication
    US 20070265789 2007-11-15
  • Granted
    US 7781732 2010-08-24
Supplementary

granted patent: Real-Time S-Parameter Imager

TitleReal-Time S-Parameter Imager
Granted PatentUS 7781732
Granted Date2010-08-24
Priority Date2007-05-04 US /797621
2004-07-14 US 11/890723
Inventors
Issue Date2010
Citation
US Patent 7781732. Washington, DC: US Patent and Trademark Office (USPTO), 2010 How to Cite?
AbstractDisclosed Is A Fully Automated System Capable Of Producing High Quality Real-Time S-Parameter Images. It Is A Useful And Versatile Tool In Material Science And Solid State Technology For Determining The Location Of Subsurface Defect Types And Concentrations On Bulk-Materials As Well As Thin-Films. The System Is Also Useful In Locating Top Surface Metallizations And Structures In Solid State Devices. This Imaging System Operates By Scanning The Sample Surface With Either A Small Positron Source (22Na) Or A Focused Positron Beam. The System Also Possesses Another Two Major Parts, Namely Electronic Instrumentation And Stand-Alone Imaging Software. In The System, The Processing Time And Use Of System Resources Are Constantly Monitored And Optimized For Producing High Resolution S-Parameter Image Of The Sample In Real Time With A General Purpose Personal Computer.; The System Software Possesses Special Features With Its Embedded Specialized Algorithms And Techniques That Provide The User With Adequate Freedom For Analyzing Various Aspects Of The Image In Order To Obtain A Clear Inference Of The Defect Profile While At The Same Time Keeping Automatic Track On The Instrumentation And Hardware Settings. The System Is Useful For Semiconductor And Metal Samples, Giving Excellent Quality Images Of The Subsurface Defect Profile And Has Applications For Biological Samples.
Persistent Identifierhttp://hdl.handle.net/10722/142190
References

 

DC FieldValueLanguage
dc.date.accessioned2011-10-19T06:34:34Z-
dc.date.available2011-10-19T06:34:34Z-
dc.date.issued2010-
dc.identifier.citationUS Patent 7781732. Washington, DC: US Patent and Trademark Office (USPTO), 2010en_HK
dc.identifier.urihttp://hdl.handle.net/10722/142190-
dc.description.abstractDisclosed Is A Fully Automated System Capable Of Producing High Quality Real-Time S-Parameter Images. It Is A Useful And Versatile Tool In Material Science And Solid State Technology For Determining The Location Of Subsurface Defect Types And Concentrations On Bulk-Materials As Well As Thin-Films. The System Is Also Useful In Locating Top Surface Metallizations And Structures In Solid State Devices. This Imaging System Operates By Scanning The Sample Surface With Either A Small Positron Source (22Na) Or A Focused Positron Beam. The System Also Possesses Another Two Major Parts, Namely Electronic Instrumentation And Stand-Alone Imaging Software. In The System, The Processing Time And Use Of System Resources Are Constantly Monitored And Optimized For Producing High Resolution S-Parameter Image Of The Sample In Real Time With A General Purpose Personal Computer.; The System Software Possesses Special Features With Its Embedded Specialized Algorithms And Techniques That Provide The User With Adequate Freedom For Analyzing Various Aspects Of The Image In Order To Obtain A Clear Inference Of The Defect Profile While At The Same Time Keeping Automatic Track On The Instrumentation And Hardware Settings. The System Is Useful For Semiconductor And Metal Samples, Giving Excellent Quality Images Of The Subsurface Defect Profile And Has Applications For Biological Samples.en_HK
dc.relation.isreferencedbyUS 2010322505 (A1) 2010-12-23en_HK
dc.relation.isreferencedbyUS 8053724 (B2) 2011-11-08en_HK
dc.titleReal-Time S-Parameter Imageren_HK
dc.typePatenten_US
dc.identifier.emailBeling, Christopher David:en_US
dc.identifier.emailFung, H Y Stevenson:en_US
dc.identifier.emailNaik, Sabitru Pranab:en_US
dc.description.naturepublished_or_final_version-
dc.identifier.hkuros184571-
dc.contributor.inventorNaik, Sabitru Pranaben_US
dc.contributor.inventorBeling, Christopher Daviden_US
dc.contributor.inventorFung, H Y Stevensonen_US
patents.identifier.applicationUS /797621en_HK
patents.identifier.grantedUS 7781732en_HK
patents.description.assigneeUniv Hong Kong [Hk]en_HK
patents.description.countryUnited States of Americaen_HK
patents.date.publication2007-11-15en_HK
patents.date.granted2010-08-24en_HK
dc.relation.referencesUS 5301336 (A) 1994-04-05en_HK
dc.relation.referencesUS 6173438 (B1) 2001-01-09en_HK
dc.relation.referencesUS 6715139 (B1) 2004-03-30en_HK
dc.relation.referencesUS 2003195732 (A1) 2003-10-16en_HK
dc.relation.referencesUS 6961686 (B2) 2005-11-01en_HK
dc.relation.referencesUS 2003200076 (A1) 2003-10-23en_HK
dc.relation.referencesUS 6993466 (B2) 2006-01-31en_HK
dc.relation.referencesUS 3825759 (A) 1974-07-23en_HK
dc.relation.referencesUS 4064438 (A) 1977-12-20en_HK
dc.relation.referencesUS 6043489 (A) 2000-03-28en_HK
patents.identifier.hkutechidPhy-2004-00149-2en_US
patents.date.application2007-05-04en_HK
patents.date.priority2007-05-04 US /797621en_HK
patents.date.priority2004-07-14 US 11/890723en_HK
patents.description.ccUSen_HK
patents.identifier.publicationUS 20070265789en_HK
patents.relation.familyUS 2006011831 (A1) 2006-01-19en_HK
patents.relation.familyUS 7420166 (B2) 2008-09-02en_HK
patents.relation.familyUS 2007265789 (A1) 2007-11-15en_HK
patents.relation.familyUS 7781732 (B2) 2010-08-24en_HK
patents.relation.familyUS 2010322505 (A1) 2010-12-23en_HK
patents.relation.familyUS 8053724 (B2) 2011-11-08en_HK
patents.description.kindB2en_HK
patents.typePatent_granteden_HK

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