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Article: Numerical Investigation of Magnetic Resonant Coupling Technique in Inter-Chip Communication via Electromagnetics-TCAD Coupled Simulation

TitleNumerical Investigation of Magnetic Resonant Coupling Technique in Inter-Chip Communication via Electromagnetics-TCAD Coupled Simulation
Authors
KeywordsEM-TCAD simulation
inductive inter-chip communication
magnetic resonant coupling
Issue Date2012
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=20
Citation
IEEE Transactions on Magnetics, 2012, v. 48 n. 11, p. 4253-4256 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/189053
ISSN
2021 Impact Factor: 1.848
2020 SCImago Journal Rankings: 0.620
ISI Accession Number ID

 

DC FieldValueLanguage
dc.contributor.authorChen, Qen_US
dc.contributor.authorHo, SLen_US
dc.contributor.authorFu, WNen_US
dc.date.accessioned2013-09-17T14:24:49Z-
dc.date.available2013-09-17T14:24:49Z-
dc.date.issued2012en_US
dc.identifier.citationIEEE Transactions on Magnetics, 2012, v. 48 n. 11, p. 4253-4256en_US
dc.identifier.issn0018-9464-
dc.identifier.urihttp://hdl.handle.net/10722/189053-
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=20-
dc.relation.ispartofIEEE Transactions on Magneticsen_US
dc.subjectEM-TCAD simulation-
dc.subjectinductive inter-chip communication-
dc.subjectmagnetic resonant coupling-
dc.titleNumerical Investigation of Magnetic Resonant Coupling Technique in Inter-Chip Communication via Electromagnetics-TCAD Coupled Simulationen_US
dc.typeArticleen_US
dc.identifier.emailChen, Q: q1chen@hku.hken_US
dc.identifier.authorityChen, Q=rp01688en_US
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1109/TMAG.2012.2195300-
dc.identifier.scopuseid_2-s2.0-84867761943-
dc.identifier.hkuros222538en_US
dc.identifier.volume48en_US
dc.identifier.spage4253en_US
dc.identifier.epage4256en_US
dc.identifier.eissn1941-0069-
dc.identifier.isiWOS:000310194400391-
dc.identifier.issnl0018-9464-

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