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Conference Paper: Molecular Engineering of Platinum(II) Terpyridine Complexes with Tetraphenylethylene-Modified Alkynyl Ligands: Supramolecular Assembly via Pt···Pt and/or π-π Stacking Interactions and the Formation of Various Superstructures

TitleMolecular Engineering of Platinum(II) Terpyridine Complexes with Tetraphenylethylene-Modified Alkynyl Ligands: Supramolecular Assembly via Pt···Pt and/or π-π Stacking Interactions and the Formation of Various Superstructures
Authors
Cheng, HKYeung, CLMYam, VWW
Issue Date2018
Citation
The 25th Symposium on Chemistry Postgraduate Research in Hong Kong, The Hong Kong University of Science and Technology, Hong Kong, PR China, 28 April 2018, p. INORG-51 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/256421

 

DC FieldValueLanguage
dc.contributor.authorCheng, HK-
dc.contributor.authorYeung, CLM-
dc.contributor.authorYam, VWW-
dc.date.accessioned2018-07-20T06:34:22Z-
dc.date.available2018-07-20T06:34:22Z-
dc.date.issued2018-
dc.identifier.citationThe 25th Symposium on Chemistry Postgraduate Research in Hong Kong, The Hong Kong University of Science and Technology, Hong Kong, PR China, 28 April 2018, p. INORG-51-
dc.identifier.urihttp://hdl.handle.net/10722/256421-
dc.languageeng-
dc.relation.ispartofThe 25th Symposium on Chemistry Postgraduate Research in Hong Kong-
dc.titleMolecular Engineering of Platinum(II) Terpyridine Complexes with Tetraphenylethylene-Modified Alkynyl Ligands: Supramolecular Assembly via Pt···Pt and/or π-π Stacking Interactions and the Formation of Various Superstructures-
dc.typeConference_Paper-
dc.identifier.emailCheng, HK: chk1224@hku.hk-
dc.identifier.emailYam, VWW: wwyam@hku.hk-
dc.identifier.authorityYam, VWW=rp00822-
dc.identifier.hkuros285956-
dc.identifier.spageINORG-
dc.identifier.epage51-

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