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Conference Paper: Entropy Analysis In Heat Conduction
Title | Entropy Analysis In Heat Conduction |
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Authors | |
Issue Date | 2019 |
Citation | 607th International Academic Conference on Engineering, Technology and Innovations (IACETI) How to Cite? |
Persistent Identifier | http://hdl.handle.net/10722/274139 |
DC Field | Value | Language |
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dc.contributor.author | Tian, X | - |
dc.contributor.author | Wang, L | - |
dc.date.accessioned | 2019-08-18T14:55:51Z | - |
dc.date.available | 2019-08-18T14:55:51Z | - |
dc.date.issued | 2019 | - |
dc.identifier.citation | 607th International Academic Conference on Engineering, Technology and Innovations (IACETI) | - |
dc.identifier.uri | http://hdl.handle.net/10722/274139 | - |
dc.language | eng | - |
dc.relation.ispartof | 607th International Academic Conference on Engineering, Technology and Innovations (IACETI) | - |
dc.title | Entropy Analysis In Heat Conduction | - |
dc.type | Conference_Paper | - |
dc.identifier.email | Tian, X: tianxw@hku.hk | - |
dc.identifier.email | Wang, L: lqwang@hku.hk | - |
dc.identifier.authority | Wang, L=rp00184 | - |
dc.identifier.hkuros | 302070 | - |