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Article: Study of grain size effect of Cu metallization on interfacial microstructures of solder joints

TitleStudy of grain size effect of Cu metallization on interfacial microstructures of solder joints
Authors
Issue Date2019
Citation
Microelectronics Reliability, 2019, v. 99, p. 44-51 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/279455

 

DC FieldValueLanguage
dc.contributor.authorZHENG, Z-
dc.contributor.authorChiang, PC-
dc.contributor.authorHuang, YT-
dc.contributor.authorWang, W-
dc.contributor.authorLi, PC-
dc.contributor.authorTsai, YH-
dc.contributor.authorChen, CM-
dc.contributor.authorFeng, SPT-
dc.date.accessioned2019-11-01T07:17:41Z-
dc.date.available2019-11-01T07:17:41Z-
dc.date.issued2019-
dc.identifier.citationMicroelectronics Reliability, 2019, v. 99, p. 44-51-
dc.identifier.urihttp://hdl.handle.net/10722/279455-
dc.languageeng-
dc.relation.ispartofMicroelectronics Reliability-
dc.titleStudy of grain size effect of Cu metallization on interfacial microstructures of solder joints-
dc.typeArticle-
dc.identifier.emailHuang, YT: ythuang@connect.hku.hk-
dc.identifier.emailWang, W: wtwang77@hku.hk-
dc.identifier.emailFeng, SPT: hpfeng@hku.hk-
dc.identifier.authorityFeng, SPT=rp01533-
dc.identifier.doi10.1016/j.microrel.2019.05.018-
dc.identifier.hkuros308569-
dc.identifier.volume99-
dc.identifier.spage44-
dc.identifier.epage51-

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