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Article: TEM study of the microstructure and interfaces in YBa2Cu3Oy thin films grown on silicon with a Eu2CuO4/Y-ZrO2 bi-layer buffer

TitleTEM study of the microstructure and interfaces in YBa2Cu3Oy thin films grown on silicon with a Eu2CuO4/Y-ZrO2 bi-layer buffer
Authors
Gao, JFu, ELuo, ZWang, ZYu, DP
Issue Date2007
PublisherWorld Scientific Publishing Co Pte Ltd. The Journal's web site is located at http://www.worldscinet.com/srl/srl.shtml
Citation
Surface Review and Letters, 2007, v. 14 n. 4, p. 751-754 How to Cite?
DOI: http://dx.doi.org/10.1142/S0218625X07010196
Persistent Identifierhttp://hdl.handle.net/10722/80874
ISSN
0218-625X
2021 Impact Factor: 1.240
2020 SCImago Journal Rankings: 0.261
ISI Accession Number ID
WOS:000251387500041

 

DC FieldValueLanguage
dc.contributor.authorGao, Jen_HK
dc.contributor.authorFu, Een_HK
dc.contributor.authorLuo, Zen_HK
dc.contributor.authorWang, Zen_HK
dc.contributor.authorYu, DPen_HK
dc.date.accessioned2010-09-06T08:11:13Z-
dc.date.available2010-09-06T08:11:13Z-
dc.date.issued2007en_HK
dc.identifier.citationSurface Review and Letters, 2007, v. 14 n. 4, p. 751-754en_HK
dc.identifier.issn0218-625Xen_HK
dc.identifier.urihttp://hdl.handle.net/10722/80874-
dc.languageengen_HK
dc.publisherWorld Scientific Publishing Co Pte Ltd. The Journal's web site is located at http://www.worldscinet.com/srl/srl.shtmlen_HK
dc.relation.ispartofSurface Review and Lettersen_HK
dc.titleTEM study of the microstructure and interfaces in YBa2Cu3Oy thin films grown on silicon with a Eu2CuO4/Y-ZrO2 bi-layer bufferen_HK
dc.typeArticleen_HK
dc.identifier.openurlhttp://library.hku.hk:4550/resserv?sid=HKU:IR&issn=0218-625X&volume=14&spage=751&epage=754&date=2007&atitle=TEM+study+of+the+microstructure+and+interfaces+in+YBa2Cu3Oy+thin+films+grown+on+silicon+with+a+Eu2CuO4/Y-ZrO2+bi-layer+bufferen_HK
dc.identifier.emailGao, J: jugao@hku.hken_HK
dc.identifier.authorityGao, J=rp00699en_HK
dc.identifier.doi10.1142/S0218625X07010196-
dc.identifier.scopuseid_2-s2.0-34548447577-
dc.identifier.hkuros137650en_HK
dc.identifier.isiWOS:000251387500041-
dc.identifier.issnl0218-625X-

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