Showing results 15 to 16 of 16
< previous
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Three-dimensional reconstruction of wafer solder bumps using binary pattern projection Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2005 | ||
Use of paraplanar constraint for parallel inspection of wafer bump heights Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition, IPCV 2007 | 2007 |