Showing results 15 to 16 of 16
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Title | Author(s) | Issue Date | |
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Three-dimensional reconstruction of wafer solder bumps using binary pattern projection Proceeding/Conference:Proceedings of SPIE - The International Society for Optical Engineering | 2005 | ||
Use of paraplanar constraint for parallel inspection of wafer bump heights Proceeding/Conference:International Conference on Image Processing, Computer Vision, and Pattern Recognition, IPCV 2007 | 2007 |