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Conference Paper: Use of paraplanar constraint for parallel inspection of wafer bump heights

TitleUse of paraplanar constraint for parallel inspection of wafer bump heights
Authors
Dong, MChung, RLam, EYMFung, SM
Issue Date2007
PublisherCSREA Press
Citation
International Conference on Image Processing, Computer Vision, and Pattern Recognition (IPCV 2007), Las Vegas, NV, 25-28 June 2007, p. 157-163 How to Cite?
Persistent Identifierhttp://hdl.handle.net/10722/99806
ISBN
1-60132-043-4

 

DC FieldValueLanguage
dc.contributor.authorDong, Men_HK
dc.contributor.authorChung, Ren_HK
dc.contributor.authorLam, EYMen_HK
dc.contributor.authorFung, SMen_HK
dc.date.accessioned2010-09-25T18:44:55Z-
dc.date.available2010-09-25T18:44:55Z-
dc.date.issued2007en_HK
dc.identifier.citationInternational Conference on Image Processing, Computer Vision, and Pattern Recognition (IPCV 2007), Las Vegas, NV, 25-28 June 2007, p. 157-163-
dc.identifier.isbn1-60132-043-4-
dc.identifier.urihttp://hdl.handle.net/10722/99806-
dc.languageengen_HK
dc.publisherCSREA Press-
dc.relation.ispartofInternational Conference on Image Processing, Computer Vision, and Pattern Recognition, IPCV 2007en_HK
dc.titleUse of paraplanar constraint for parallel inspection of wafer bump heightsen_HK
dc.typeConference_Paperen_HK
dc.identifier.emailLam, EYM: elam@eee.hku.hken_HK
dc.identifier.authorityLam, EYM=rp00131en_HK
dc.identifier.hkuros128186en_HK

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