Showing results 3 to 6 of 6
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Title | Author(s) | Issue Date | |
---|---|---|---|
2002 | |||
Hepatitis B virus genotype A and D clinical outcomes of liver transplantation for HBV-related disease Journal:Liver Transplantation | 2004 | ||
Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2008 | ||
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures Journal:IEEE Transactions on Advanced Packaging | 2010 |