Showing results 1 to 5 of 5
| Title | Author(s) | Issue Date | |
|---|---|---|---|
Chip Size Minimization for Wide and Ultrawide Bandgap Power Devices Journal:IEEE Transactions on Electron Devices | 2023 | ||
(Invited) How to Achieve Low Thermal Resistance and High Electrothermal Ruggedness in Ga<inf>2</inf>O<inf>3</inf>Devices? Proceeding/Conference:ECS Transactions | 2021 | ||
Low Thermal Resistance (0.5 K/W) GaO Schottky Rectifiers with Double-Side Packaging Journal:IEEE Electron Device Letters | 2021 | ||
Packaged Ga<inf>2</inf>O<inf>3</inf>Schottky Rectifiers with over 60-A Surge Current Capability Journal:IEEE Transactions on Power Electronics | 2021 | ||
Packaging of a 10-kV Double-Side Cooled Silicon Carbide Diode Module With Thin Substrates Coated by a Nonlinear Resistive Polymer-Nanoparticle Composite Journal:IEEE Transactions on Power Electronics | 2022 |