Browsing by Author Mao, JUNFA

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TitleAuthor(s)Issue Date
 
Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method
Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology
Li, PDong, YILINTang, MINMao, JUNFAJiang, LBagci, HAKAN
2017
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