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Article: Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method

TitleTransient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method
Authors
Li, PDong, YILINTang, MINMao, JUNFAJiang, LBagci, HAKAN
KeywordsAuxiliary-differential equation (ADE) method
discontinuous Galerkin time-domain (DGTD) method
integrated circuit package
numerical flux
transient thermal analysis
Issue Date2017
PublisherIEEE. The Journal's web site is located at http://cpmt.ieee.org/transactions-on-cpmt.html
Citation
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, v. 7, p. 862-871 How to Cite?
DOI: http://dx.doi.org/10.1109/TCPMT.2017.2666259
Persistent Identifierhttp://hdl.handle.net/10722/247416
ISSN
2156-3950
2021 Impact Factor: 1.922
2020 SCImago Journal Rankings: 0.496
ISI Accession Number ID
WOS:000402736000006

 

DC FieldValueLanguage
dc.contributor.authorLi, P-
dc.contributor.authorDong, YILIN-
dc.contributor.authorTang, MIN-
dc.contributor.authorMao, JUNFA-
dc.contributor.authorJiang, L-
dc.contributor.authorBagci, HAKAN-
dc.date.accessioned2017-10-18T08:26:54Z-
dc.date.available2017-10-18T08:26:54Z-
dc.date.issued2017-
dc.identifier.citationIEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, v. 7, p. 862-871-
dc.identifier.issn2156-3950-
dc.identifier.urihttp://hdl.handle.net/10722/247416-
dc.languageeng-
dc.publisherIEEE. The Journal's web site is located at http://cpmt.ieee.org/transactions-on-cpmt.html-
dc.relation.ispartofIEEE Transactions on Components, Packaging and Manufacturing Technology-
dc.rightsIEEE Transactions on Components, Packaging and Manufacturing Technology. Copyright © IEEE.-
dc.rights©20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. -
dc.subjectAuxiliary-differential equation (ADE) method-
dc.subjectdiscontinuous Galerkin time-domain (DGTD) method-
dc.subjectintegrated circuit package-
dc.subjectnumerical flux-
dc.subjecttransient thermal analysis-
dc.titleTransient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method-
dc.typeArticle-
dc.identifier.emailLi, P: liping@eee.hku.hk-
dc.identifier.emailJiang, L: jianglj@hku.hk-
dc.identifier.authorityLi, P=rp02237-
dc.identifier.authorityJiang, L=rp01338-
dc.identifier.doi10.1109/TCPMT.2017.2666259-
dc.identifier.scopuseid_2-s2.0-85016496903-
dc.identifier.hkuros280750-
dc.identifier.volume7-
dc.identifier.spage862-
dc.identifier.epage871-
dc.identifier.isiWOS:000402736000006-
dc.publisher.placeUnited States-
dc.identifier.issnl2156-3950-

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