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Title | Author(s) | Issue Date | Views | |
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Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2008 | 114 |
Title | Author(s) | Issue Date | Views | |
---|---|---|---|---|
Thermal modeling of on-chip interconnects and 3D packaging using EM tools Proceeding/Conference:Electrical Performance of Electronic Packaging, EPEP | 2008 | 114 |