Browsing by Author Tang, MIN

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TitleAuthor(s)Issue DateViews
 
Advisor(s):Li, YLiu, Z
2014
135
 
2019
12
 
2018
4
 
2009
11
 
2009
10
 
Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method
Journal:IEEE Transactions on Components, Packaging and Manufacturing Technology
2017
46