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Article: A new noncontact method for the prediction of both internal thermal resistance and junction temperature of white light-emitting diodes

TitleA new noncontact method for the prediction of both internal thermal resistance and junction temperature of white light-emitting diodes
Authors
KeywordsLight-Emitting Diodes (LED) System Theory
Lighting
Issue Date2012
PublisherIEEE
Citation
IEEE Transactions on Power Electronics, 2012, v. 27 n. 4, p. 2184-2192 How to Cite?
AbstractAlthough critical to the lifetime of LED, the junction temperature of LED cannot be measured easily. Based on the general photoelectrothermal theory for LED systems, the coefficient for the reduction of luminous efficacy with junction temperature is first related to the characteristic temperature of the LED. Then, a noncontact method for estimating the internal junction temperature T j and junction-case thermal resistance R jc of LED from the external power and luminous flux measurements is presented and verified practically. Since these external measurements can be obtained easily, the proposal provides a simple tool for checking T j in new LED system designs without using expensive or sophisticated thermal monitoring equipment for the LED junctions. The proposed method has been checked with measurements on LED devices from three different brands with both constant and nonconstant R jc. The theoretical predictions are found to be highly consistent with practical measurements. © 2011 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/155738
ISSN
2023 Impact Factor: 6.6
2023 SCImago Journal Rankings: 3.644
ISI Accession Number ID
Funding AgencyGrant Number
Hong Kong Research Grant CouncilHKU-114411
Funding Information:

Manuscript received July 28, 2011; accepted August 29, 2011. Date of current version February 20, 2012. This work was supported by Hong Kong Research Grant Council under Project HKU-114411. Recommended for publication by Associate Editor J. M. Alonso.

References

 

DC FieldValueLanguage
dc.contributor.authorTao, Xen_US
dc.contributor.authorChen, Hen_US
dc.contributor.authorLi, SNen_US
dc.contributor.authorHui, SYRen_US
dc.date.accessioned2012-08-08T08:35:06Z-
dc.date.available2012-08-08T08:35:06Z-
dc.date.issued2012en_US
dc.identifier.citationIEEE Transactions on Power Electronics, 2012, v. 27 n. 4, p. 2184-2192en_US
dc.identifier.issn0885-8993en_US
dc.identifier.urihttp://hdl.handle.net/10722/155738-
dc.description.abstractAlthough critical to the lifetime of LED, the junction temperature of LED cannot be measured easily. Based on the general photoelectrothermal theory for LED systems, the coefficient for the reduction of luminous efficacy with junction temperature is first related to the characteristic temperature of the LED. Then, a noncontact method for estimating the internal junction temperature T j and junction-case thermal resistance R jc of LED from the external power and luminous flux measurements is presented and verified practically. Since these external measurements can be obtained easily, the proposal provides a simple tool for checking T j in new LED system designs without using expensive or sophisticated thermal monitoring equipment for the LED junctions. The proposed method has been checked with measurements on LED devices from three different brands with both constant and nonconstant R jc. The theoretical predictions are found to be highly consistent with practical measurements. © 2011 IEEE.en_US
dc.languageengen_US
dc.publisherIEEE-
dc.relation.ispartofIEEE Transactions on Power Electronicsen_US
dc.subjectLight-Emitting Diodes (LED) System Theoryen_US
dc.subjectLightingen_US
dc.titleA new noncontact method for the prediction of both internal thermal resistance and junction temperature of white light-emitting diodesen_US
dc.typeArticleen_US
dc.identifier.emailHui, SYR:ronhui@eee.hku.hken_US
dc.identifier.authorityHui, SYR=rp01510en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/TPEL.2011.2169461en_US
dc.identifier.scopuseid_2-s2.0-84863115557-
dc.identifier.hkuros209240-
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-84857476075&selection=ref&src=s&origin=recordpageen_US
dc.identifier.volume27en_US
dc.identifier.issue4en_US
dc.identifier.spage2184en_US
dc.identifier.epage2192en_US
dc.identifier.isiWOS:000300581500048-
dc.publisher.placeUnited Statesen_US
dc.identifier.scopusauthoridTao, X=36086850500en_US
dc.identifier.scopusauthoridChen, H=55030580700en_US
dc.identifier.scopusauthoridLi, SN=55028285200en_US
dc.identifier.scopusauthoridHui, SYR=7202831744en_US
dc.customcontrol.immutablejt 031328-
dc.identifier.issnl0885-8993-

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