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Conference Paper: The use of fast integral equations solvers for practical package and interconnect analysis

TitleThe use of fast integral equations solvers for practical package and interconnect analysis
Authors
Morsey, JDRubin, BJJiang, LShan, LEisenberg, LBBecker, DArseneault, M
KeywordsElectromagnetic Modeling Tools
Fast Solvers
Full-Wave Electromagnetic Field Solver
Iterative Solutions
Issue Date2006
Citation
Electrical Performance Of Electronic Packaging, Epep, 2006, p. 335-338 How to Cite?
DOI: http://dx.doi.org/10.1109/EPEP.2006.321246
AbstractFast integral equation methods are now being applied to packaging and other such "low frequency" problems. This paper explores some of the issues surrounding such an application to real, product level packaging and interconnect type structures. Discussed are issues such as low frequency breakdown, mesh aspect ratios, and solver convergence. Finally, integral equation solver examples are presented using the IBM internally developed pre-corrected FFT (PFFT) solver labeled EMSurf[l]. ©2006 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/158465
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorMorsey, JDen_US
dc.contributor.authorRubin, BJen_US
dc.contributor.authorJiang, Len_US
dc.contributor.authorShan, Len_US
dc.contributor.authorEisenberg, LBen_US
dc.contributor.authorBecker, Den_US
dc.contributor.authorArseneault, Men_US
dc.date.accessioned2012-08-08T08:59:47Z-
dc.date.available2012-08-08T08:59:47Z-
dc.date.issued2006en_US
dc.identifier.citationElectrical Performance Of Electronic Packaging, Epep, 2006, p. 335-338en_US
dc.identifier.urihttp://hdl.handle.net/10722/158465-
dc.description.abstractFast integral equation methods are now being applied to packaging and other such "low frequency" problems. This paper explores some of the issues surrounding such an application to real, product level packaging and interconnect type structures. Discussed are issues such as low frequency breakdown, mesh aspect ratios, and solver convergence. Finally, integral equation solver examples are presented using the IBM internally developed pre-corrected FFT (PFFT) solver labeled EMSurf[l]. ©2006 IEEE.en_US
dc.languageengen_US
dc.relation.ispartofElectrical Performance of Electronic Packaging, EPEPen_US
dc.subjectElectromagnetic Modeling Toolsen_US
dc.subjectFast Solversen_US
dc.subjectFull-Wave Electromagnetic Field Solveren_US
dc.subjectIterative Solutionsen_US
dc.titleThe use of fast integral equations solvers for practical package and interconnect analysisen_US
dc.typeConference_Paperen_US
dc.identifier.emailJiang, L:ljiang@eee.hku.hken_US
dc.identifier.authorityJiang, L=rp01338en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/EPEP.2006.321246en_US
dc.identifier.scopuseid_2-s2.0-34249784272en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-34249784272&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage335en_US
dc.identifier.epage338en_US
dc.identifier.scopusauthoridMorsey, JD=6603025809en_US
dc.identifier.scopusauthoridRubin, BJ=7201761344en_US
dc.identifier.scopusauthoridJiang, L=36077777200en_US
dc.identifier.scopusauthoridShan, L=15073437300en_US
dc.identifier.scopusauthoridEisenberg, LB=15753439500en_US
dc.identifier.scopusauthoridBecker, D=7401884382en_US
dc.identifier.scopusauthoridArseneault, M=22833382700en_US

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