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Conference Paper: Electromagnetic simulation for inhomogeneous interconnect and packaging structures

TitleElectromagnetic simulation for inhomogeneous interconnect and packaging structures
Authors
Jiang, LRubin, BJLiu, YMorsey, JDDeustch, A
Issue Date2007
Citation
Ieee Topical Meeting On Electrical Performance Of Electronic Packaging, 2007, p. 357-360 How to Cite?
DOI: http://dx.doi.org/10.1109/EPEP.2007.4387202
AbstractThe paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only Equivalent Principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm. © 2007 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/158531
References
References in Scopus

 

DC FieldValueLanguage
dc.contributor.authorJiang, Len_US
dc.contributor.authorRubin, BJen_US
dc.contributor.authorLiu, Yen_US
dc.contributor.authorMorsey, JDen_US
dc.contributor.authorDeustch, Aen_US
dc.date.accessioned2012-08-08T09:00:07Z-
dc.date.available2012-08-08T09:00:07Z-
dc.date.issued2007en_US
dc.identifier.citationIeee Topical Meeting On Electrical Performance Of Electronic Packaging, 2007, p. 357-360en_US
dc.identifier.urihttp://hdl.handle.net/10722/158531-
dc.description.abstractThe paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only Equivalent Principle based EFIE instead of both EFIE and MFIE to establish the surface integral equations for practical inhomogeneous structure so that a much more simplified formulation process is needed in the EM simulation procedure. To overcome the numerical error of K operator in the formulation, a new analytical solution to the K operator for general full-wave integral equations is provided. Numerical results are demonstrated to verify the proposed algorithm. © 2007 IEEE.en_US
dc.languageengen_US
dc.relation.ispartofIEEE Topical Meeting on Electrical Performance of Electronic Packagingen_US
dc.titleElectromagnetic simulation for inhomogeneous interconnect and packaging structuresen_US
dc.typeConference_Paperen_US
dc.identifier.emailJiang, L:ljiang@eee.hku.hken_US
dc.identifier.authorityJiang, L=rp01338en_US
dc.description.naturelink_to_subscribed_fulltexten_US
dc.identifier.doi10.1109/EPEP.2007.4387202en_US
dc.identifier.scopuseid_2-s2.0-47949128482en_US
dc.relation.referenceshttp://www.scopus.com/mlt/select.url?eid=2-s2.0-47949128482&selection=ref&src=s&origin=recordpageen_US
dc.identifier.spage357en_US
dc.identifier.epage360en_US
dc.identifier.scopusauthoridJiang, L=36077777200en_US
dc.identifier.scopusauthoridRubin, BJ=7201761344en_US
dc.identifier.scopusauthoridLiu, Y=14054355100en_US
dc.identifier.scopusauthoridMorsey, JD=6603025809en_US
dc.identifier.scopusauthoridDeustch, A=51963405800en_US

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