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- Publisher Website: 10.1109/TMTT.2007.908678
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Article: Generalized impedance boundary condition for conductor modeling in surface integral equation
Title | Generalized impedance boundary condition for conductor modeling in surface integral equation |
---|---|
Authors | |
Keywords | Full-Wave Solver Generalized Impedance Boundary Condition Impedance Boundary Condition Interconnects Loop Tree Mixed-Form Fast Multipole Algorithm Skin Effect Surface Integral Equation |
Issue Date | 2007 |
Citation | Ieee Transactions On Microwave Theory And Techniques, 2007, v. 55 n. 11, p. 2354-2364 How to Cite? |
Abstract | A generalized impedance boundary condition is developed to rigorously model on-chip interconnects in the full-wave surface integral equation by a two-region formulation. It is a combination of the electric-field integral equation for the exterior region and the magnetic-field integral equation for the interior conductive region. The skin effect is, therefore, well captured. A novel integration technique is proposed to evaluate the Green's function integrals in the conductive medium. Towards tackling large-scale problems, the mixed-form fast multipole algorithm and the multifrontal method are incorporated. A new scheme of the loop-tree decomposition is also used to alleviate the low-frequency breakdown for the formulation. Numerical examples show the accuracy and reduced computation cost. © 2007 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/182736 |
ISSN | 2023 Impact Factor: 4.1 2023 SCImago Journal Rankings: 1.633 |
ISI Accession Number ID | |
References |
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Qian, ZG | en_US |
dc.contributor.author | Chew, WC | en_US |
dc.contributor.author | Suaya, R | en_US |
dc.date.accessioned | 2013-05-02T05:16:39Z | - |
dc.date.available | 2013-05-02T05:16:39Z | - |
dc.date.issued | 2007 | en_US |
dc.identifier.citation | Ieee Transactions On Microwave Theory And Techniques, 2007, v. 55 n. 11, p. 2354-2364 | en_US |
dc.identifier.issn | 0018-9480 | en_US |
dc.identifier.uri | http://hdl.handle.net/10722/182736 | - |
dc.description.abstract | A generalized impedance boundary condition is developed to rigorously model on-chip interconnects in the full-wave surface integral equation by a two-region formulation. It is a combination of the electric-field integral equation for the exterior region and the magnetic-field integral equation for the interior conductive region. The skin effect is, therefore, well captured. A novel integration technique is proposed to evaluate the Green's function integrals in the conductive medium. Towards tackling large-scale problems, the mixed-form fast multipole algorithm and the multifrontal method are incorporated. A new scheme of the loop-tree decomposition is also used to alleviate the low-frequency breakdown for the formulation. Numerical examples show the accuracy and reduced computation cost. © 2007 IEEE. | en_US |
dc.language | eng | en_US |
dc.relation.ispartof | IEEE Transactions on Microwave Theory and Techniques | en_US |
dc.subject | Full-Wave Solver | en_US |
dc.subject | Generalized Impedance Boundary Condition | en_US |
dc.subject | Impedance Boundary Condition | en_US |
dc.subject | Interconnects | en_US |
dc.subject | Loop Tree | en_US |
dc.subject | Mixed-Form Fast Multipole Algorithm | en_US |
dc.subject | Skin Effect | en_US |
dc.subject | Surface Integral Equation | en_US |
dc.title | Generalized impedance boundary condition for conductor modeling in surface integral equation | en_US |
dc.type | Article | en_US |
dc.identifier.email | Chew, WC: wcchew@hku.hk | en_US |
dc.identifier.authority | Chew, WC=rp00656 | en_US |
dc.description.nature | link_to_subscribed_fulltext | en_US |
dc.identifier.doi | 10.1109/TMTT.2007.908678 | en_US |
dc.identifier.scopus | eid_2-s2.0-36649018525 | en_US |
dc.relation.references | http://www.scopus.com/mlt/select.url?eid=2-s2.0-36649018525&selection=ref&src=s&origin=recordpage | en_US |
dc.identifier.volume | 55 | en_US |
dc.identifier.issue | 11 | en_US |
dc.identifier.spage | 2354 | en_US |
dc.identifier.epage | 2364 | en_US |
dc.identifier.isi | WOS:000250897400010 | - |
dc.publisher.place | United States | en_US |
dc.identifier.scopusauthorid | Qian, ZG=9043842600 | en_US |
dc.identifier.scopusauthorid | Chew, WC=36014436300 | en_US |
dc.identifier.scopusauthorid | Suaya, R=6506696200 | en_US |
dc.identifier.issnl | 0018-9480 | - |