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- Publisher Website: 10.1109/EDAPS.2012.6469426
- Scopus: eid_2-s2.0-84875500517
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Conference Paper: Electromagnetic emissions from the IC packaging
Title | Electromagnetic emissions from the IC packaging |
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Authors | |
Keywords | Cavity modes EMC/EMI IC packaging Radiated emission Via radiation Trace radiation |
Issue Date | 2012 |
Publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1002555 |
Citation | The 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2012), Taipei, Taiwan, 9-11 December 2012. In Electrical Design of Advanced Packaging and Systems Symposium Proceedings, 2012, p. 65-68, article no. 6469426 How to Cite? |
Abstract | The EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results. © 2012 IEEE. |
Persistent Identifier | http://hdl.handle.net/10722/186720 |
ISBN |
DC Field | Value | Language |
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dc.contributor.author | Huang, NKH | en_US |
dc.contributor.author | Jiang, L | en_US |
dc.contributor.author | Yu, HC | en_US |
dc.contributor.author | Li, G | en_US |
dc.contributor.author | Xu, S. | en_US |
dc.contributor.author | Wang, T | en_US |
dc.contributor.author | Ren, HS | en_US |
dc.date.accessioned | 2013-08-20T12:19:14Z | - |
dc.date.available | 2013-08-20T12:19:14Z | - |
dc.date.issued | 2012 | en_US |
dc.identifier.citation | The 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2012), Taipei, Taiwan, 9-11 December 2012. In Electrical Design of Advanced Packaging and Systems Symposium Proceedings, 2012, p. 65-68, article no. 6469426 | en_US |
dc.identifier.isbn | 978-14673-1443-5 | - |
dc.identifier.uri | http://hdl.handle.net/10722/186720 | - |
dc.description.abstract | The EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results. © 2012 IEEE. | - |
dc.language | eng | en_US |
dc.publisher | IEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1002555 | en_US |
dc.relation.ispartof | Electrical Design of Advanced Packaging and Systems Symposium Proceedings | en_US |
dc.subject | Cavity modes | - |
dc.subject | EMC/EMI | - |
dc.subject | IC packaging | - |
dc.subject | Radiated emission | - |
dc.subject | Via radiation | - |
dc.subject | Trace radiation | - |
dc.title | Electromagnetic emissions from the IC packaging | en_US |
dc.type | Conference_Paper | en_US |
dc.identifier.email | Huang, NKH: khhuang@eee.hku.hk | en_US |
dc.identifier.email | Jiang, L: jianglj@hku.hk | - |
dc.identifier.email | Wang, T: taowang@us.ibm.com | - |
dc.identifier.authority | Jiang, L=rp01338 | en_US |
dc.description.nature | link_to_subscribed_fulltext | - |
dc.identifier.doi | 10.1109/EDAPS.2012.6469426 | - |
dc.identifier.scopus | eid_2-s2.0-84875500517 | - |
dc.identifier.hkuros | 218859 | en_US |
dc.identifier.spage | 65 | en_US |
dc.identifier.epage | 68 | en_US |
dc.publisher.place | United States | - |
dc.customcontrol.immutable | sml 130322 | - |