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Conference Paper: Electromagnetic emissions from the IC packaging

TitleElectromagnetic emissions from the IC packaging
Authors
Huang, NKHJiang, LYu, HCLi, GXu, S.Wang, TRen, HS
KeywordsCavity modes
EMC/EMI
IC packaging
Radiated emission
Via radiation
Trace radiation
Issue Date2012
PublisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1002555
Citation
The 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2012), Taipei, Taiwan, 9-11 December 2012. In Electrical Design of Advanced Packaging and Systems Symposium Proceedings, 2012, p. 65-68, article no. 6469426 How to Cite?
DOI: http://dx.doi.org/10.1109/EDAPS.2012.6469426
AbstractThe EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results. © 2012 IEEE.
Persistent Identifierhttp://hdl.handle.net/10722/186720
ISBN
978-14673-1443-5

 

DC FieldValueLanguage
dc.contributor.authorHuang, NKHen_US
dc.contributor.authorJiang, Len_US
dc.contributor.authorYu, HCen_US
dc.contributor.authorLi, Gen_US
dc.contributor.authorXu, S.en_US
dc.contributor.authorWang, Ten_US
dc.contributor.authorRen, HSen_US
dc.date.accessioned2013-08-20T12:19:14Z-
dc.date.available2013-08-20T12:19:14Z-
dc.date.issued2012en_US
dc.identifier.citationThe 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS 2012), Taipei, Taiwan, 9-11 December 2012. In Electrical Design of Advanced Packaging and Systems Symposium Proceedings, 2012, p. 65-68, article no. 6469426en_US
dc.identifier.isbn978-14673-1443-5-
dc.identifier.urihttp://hdl.handle.net/10722/186720-
dc.description.abstractThe EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results. © 2012 IEEE.-
dc.languageengen_US
dc.publisherIEEE. The Journal's web site is located at http://ieeexplore.ieee.org/xpl/conhome.jsp?punumber=1002555en_US
dc.relation.ispartofElectrical Design of Advanced Packaging and Systems Symposium Proceedingsen_US
dc.subjectCavity modes-
dc.subjectEMC/EMI-
dc.subjectIC packaging-
dc.subjectRadiated emission-
dc.subjectVia radiation-
dc.subjectTrace radiation-
dc.titleElectromagnetic emissions from the IC packagingen_US
dc.typeConference_Paperen_US
dc.identifier.emailHuang, NKH: khhuang@eee.hku.hken_US
dc.identifier.emailJiang, L: jianglj@hku.hk-
dc.identifier.emailWang, T: taowang@us.ibm.com-
dc.identifier.authorityJiang, L=rp01338en_US
dc.description.naturelink_to_subscribed_fulltext-
dc.identifier.doi10.1109/EDAPS.2012.6469426-
dc.identifier.scopuseid_2-s2.0-84875500517-
dc.identifier.hkuros218859en_US
dc.identifier.spage65en_US
dc.identifier.epage68en_US
dc.publisher.placeUnited States-
dc.customcontrol.immutablesml 130322-

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