Wideband lumped element model for on-chip interconnects on lossy silicon substrate

Abstract

This work presents the fully lumped element model for wideband on-chip interconnects, with large scalability of line lengths up to 8000 μm, and widths down to 100 nm. Both the series and the shunt lumped elements of the model are determined based on the frequency asymptotic technique without any optimization. The equivalent lumped circuit is derived and verified to accurately recover the frequency-dependent parameters up to 40 GHz, where all the parasitic effects are accounted for based on the EM simulation and measurement. The convergence of the cascaded lumped element model is analyzed for the minimal requirement of desired wideband and distributed performance. The frequency responses of the proposed model agree well with those of the distributed transmission line model and measurements. Finally, the model is validated by comparing simulated and measured Scattering-parameters.