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Title	Author(s)	Issue Date	Views
Behavior of copper removal by CMP and its correlation to deposit structure and impurity content Journal:Journal of the Electrochemical Society	Feng, HP Lin, JY Cheng, MY Wang, YY Wan, CC	2008
Capacitance of Atomic Junctions Journal:Physical Review Letters	Wang, J Guo, H Mozos, JL Wan, CC Taraschi, G Zheng, Q	1998	208
Cloud manufacturing in China: a review Journal:International Journal of Computer Integrated Manufacturing	Wan, CC Zheng, H-L Guo, L Xu, X Zhong, RY Yan, F	2020	68
Displacement reactions between metal ions and nitride barrier layer/silicon substrate Journal:Journal of the Electrochemical Society	Wu, Y Chen, WC Feng, HP Wan, CC Wang, YY	2002	195
Dynamic admittance of atomic wires Journal:Physical Review B (Condensed Matter)	Wan, CC Mozos, JL Wang, J Guo, H	1997
Effect of impurity and illumination on copper oxidation after chemical mechanical polishing Journal:Journal of the Electrochemical Society	Feng, HP Lin, JY Wang, YY Wan, CC	2008	216
Effects of Iodine Content in the Electrolyte on the Charge Transfer and Power Conversion Efficiency of Dye-sensitized Solar Cell under Low Light Intensities Journal:The Journal of Physical Chemistry C	Lan, JL Wei, TC Feng, SPT Wan, CC Cao, G	2012	66
Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation Journal:Journal of Electronic Materials	Feng, HP Wu, Y Wang, YY Wan, CC	2003	190
Fibrosis-related growth factors in peritoneal dialysate during peritonitis Proceeding/Conference:Peritoneal Dialysis International	Wan, CC Yung, SSY Tsang, RCW Chan, DTM	2006	87
Gram-negative peritonitis is associated with higher dialysate levels of pro-inflammatory cytokines Proceeding/Conference:Journal of the American Society of Nephrology Abstract Supplement	Yung, SSY Wan, CC Chan, DTM	2008	99
Impurities induced localized corrosion between copper and tantalum nitride during chemical mechanical planarization Journal:Electrochemical and Solid-State Letters	Lin, JY Wang, YY Wan, CC Feng, HP Cheng, MY	2007	194
Induction of IL-6 and matrix protein synthesis in human peritoneal mesothelial cells by Pseudomonas aeruginosa exotoxin pyocyanin Proceeding/Conference:Journal of the American Society of Nephrology Abstract Supplement	Yung, SSY Wan, CC Tsang, RCW Mak, JCW Tsang, KWT Chan, DTM	2006	139
Investigation of the behaviors of various electroplated copper films during CMP Proceeding/Conference:2006 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2006 Technical Proceedings	Feng, HP Cheng, MY Wang, YY Wan, CC	2006	115
Mechanism for Cu void defect on various electroplated film conditions Journal:Thin Solid Films	Feng, HP Cheng, MY Wang, YL Chang, SC Wang, YY Wan, CC	2006	197
Platinum nanoparticles on flexible carbon fiber paper without transparent conducting oxide glass as counter electrode for dye-sensitized solar cells Journal:Journal of the Chinese Chemical Society	Lan, JL Feng, HP Wei, TC Peng, C Cheng, HP Chen, WH Chang, YH Hsu, WC Wan, CC	2010	212
Quantized conductance of Si atomic wires Journal:Physical Review B (Condensed Matter)	Mozos, JL Wan, CC Taraschi, G Wang, J Guo, H	1997	177
Quantum transport through atomic wires Journal:Applied Physics Letters	Wan, CC Mozos, JL Taraschi, G Wang, J Guo, H	1997
The simple and easy way to manufacture counter electrode for dye-sensitized solar cells Journal:Current Applied Physics	Lan, JL Wang, YY Wan, CC Wei, TC Feng, HP Peng, C Cheng, HP Chang, YH Hsu, WC	2010
Structural and transport properties of aluminum atomic wires Journal:Physical Review B (Condensed Matter)	Taraschi, G Mozos, JL Wan, CC Guo, H Wang, J	1998	52
Void defect reduction after chemical mechanical planarization of trenches filled by direct/pulse plating Journal:Journal of the Electrochemical Society	Lin, JY Wan, CC Wang, YY Feng, HP	2007	191

Showing results 1 to 20 of 20